Toshiba Memory Holdings Corporation, which will rebrand as Kioxia Holdings Corporation on October 1, 2019, announced today that it has signed a definitive agreement with LITE-ON Technology Corporation to acquire its Solid State Drive (SSD) business.
Semiconductors
Intel Updates Advanced Packaging Technologies at Semicon West, the Latest in a Decade (or more) Evolution
In the last several years, Intel has had a series of announcements in the packaging arena, focused on the integration of multiple styles of chips in the same package to improve performance and broaden system capabilities.
Superior Process Quality With Picosun’s new R&D PEALD Technology
Picosun Group, a supplier of AGILE ALD (Atomic Layer Deposition) thin film coating solutions, reports excellent results obtained with its next generation R&D PEALD (plasma-enhanced ALD) technology.
Theory Reveals the Nature of Crystals Defects (of Silicon Carbide)
Imperfections of crystal structure, especially edge dislocations of an elongated nature, deeply modify basic properties of the entire material and, in consequence, drastically limit its applications. Using silicon carbide as an example, physicists from Cracow and Warsaw have shown that even such computationally demanding defects can be successfully examined with atomic accuracy by means of a cleverly constructed, small in size, model.
Enhancing Materials for Hi-Res Patterning to Advance Microelectronics
Scientists at Brookhaven Lab’s Center for Functional Nanomaterials created ‘hybrid’ organic-inorganic materials for transferring ultrasmall, high-aspect-ratio features into silicon for next-generation electronic devices.
EV Group and Schott Partner to Demonstrate Readiness of 300mm Nanoimprint Lithography for High-Volume Augmented/Mixed Reality Glass Manufacturing
Joint work to be carried out at EVG’s NILPhotonics Competence Center, an open innovation incubator for nanoimprint lithography (NIL) and the only accessible 300mm NIL development line worldwide.
KLA Joins Automotive Electronics Council
KLA Corporation announced today that the Automotive Electronics Council (AEC), the organization that sets qualification standards for electronic components in the automotive industry, has accepted the company as an associate member.
GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany
Injunctions seek to prevent unlawful importation of infringing Taiwanese semiconductors.
RISC-V Is Experiencing a Period of Optimism and Growth with Global Revenue Expected to Reach $1.1 Billion by 2025
According to a new report from Tractica, the RISC-V movement is experiencing a dynamic period of growth, with many announcements regarding companies that are adopting RISC-V or introducing new tools for the architecture.
NUS Researchers Discover Unusual ‘Quasiparticle’ in Common 2D Material
The new quasiparticle, named ‘polaronic trion’, enables significant tunability in the optoelectronic properties of prominent 2D material, molybdenum disulphide.
