Step by step, scientists are figuring out new ways to extend Moore’s Law. The latest reveals a path toward integrated circuits with two-dimensional transistors. A Rice University scientist and his collaborators in Taiwan and China reported in Nature today that they have successfully grown atom-thick sheets of hexagonal boron nitride (hBN) as two-inch diameter crystals across a wafer.
Semiconductors
Samsung Executive Joins Si2 Board of Directors
Jung Yun Choi, corporate vice president for the Samsung Electronics Design Technology team, has been elected to the Silicon Integration Initiative board of directors. A 17-year Samsung veteran, Choi leads the team responsible for developing all design tools and methodologies for Samsung memory products: technologies and environments impacting product values, new process and package technologies, new applications and new working environments such as the Cloud.
SK Siltron Completes Acquisition of U.S. DuPont’s SiC Wafer Division
SK Siltron, a global maker of semiconductor wafers, announced today it has completed the acquisition of DuPont’s Silicon Carbide Wafer (SiC Wafer) unit. The acquisition was decided through a board meeting in September and closed on February 29.
Integra Technologies Enhances Test Services with Presto Engineering Partnership
Integra Technologies, a global provider of semiconductor services for high reliability applications, announced today a partnership with Presto Engineering’s, San Jose, Calif.-based hub, a provider of test and qualification services to the radiofrequency (RF) market in the U.S. Integra and Presto Engineering have entered into an agreement whereby Presto will consign its existing RF test equipment set, located in its San Jose, Calif. facility, to Integra Technology’s Milpitas, Calif. location.
CEVA Unveils World’s Most Powerful DSP Architecture
CEVA, Inc., a licensor of wireless connectivity and smart sensing technologies, today announced the unveiling of the world’s most powerful DSP architecture, the Gen4 CEVA-XC. This new architecture delivers unmatched performance for the most complex parallel processing workloads required for 5G endpoints and Radio Access Networks (RAN), enterprise access points and other multigigabit low latency applications.
SEMICON Southeast Asia 2020 Postponed to August 2020
SEMI announced today that it is postponing SEMICON Southeast Asia 2020, the region’s premier event for the global electronics manufacturing supply chain, from 12-14 May 2020to11-13 August 2020.The postponement is due to concern surrounding the ongoing international coronavirus (COVID-19) outbreak. The venue for SEMICON Southeast Asia 2020 will remain the Malaysia International Trade and Exhibition Centre (MITEC). “After close consultation with our stakeholders, which include partners, exhibitors, industry peers and the general…
BISTel Announces First Cloud Capable, A.I. Powered FDC System for Semiconductor Manufacturing
BISTel, the leading supplier of engineering automation and manufacturing A.I. applications announced today the semiconductor industry’s first cloud capable, A.I. powered, fault detection and classification system (FDC). The new FDC solution, called Dynamic Fault Detection (DFD) in the cloud, offers chipmakers a more comprehensive method for detecting faults.
Lam Research Breaks New Ground in Etch Technology and Productivity for Chipmaking Processes
Lam Research Corp. today announced the launch of a completely transformed plasma etch technology and system solution, designed to provide chipmakers with advanced functionality and extendibility required for future innovation. Lam’s groundbreaking Sense.i platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity, supporting logic and memory device roadmaps through the coming decade.
Global Semiconductor Sales Down Slightly Year-to-Year in January
“The global semiconductor market got off to a solid start in 2020, with the industry nearly posting positive year-to-year sales growth for the first time in more than a year,” said John Neuffer, SIA president and CEO. “Still, the global market faces significant macroeconomic headwinds, including global trade unrest and ongoing concerns about worldwide spread of the coronavirus, which could limit continued market recovery.”
Women in Semiconductors to Highlight Workplace Diversity at ASMC 2020
The vital importance of workplace diversity in growing the global semiconductor industry’s talent pipeline will take center stage as the Women in Semiconductors (WiS) program returns to the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2020) on May 4 in Saratoga Springs, New York. Back by popular demand, WiS continues to connect more women in the semiconductor manufacturing industry while driving critical discussions across genders. The WiS program runs in conjunction with ASMC 2020, May 4-7.
