SEMI, the global industry association representing the electronics design and manufacturing supply chain, today announced the 2019 release of the Heterogeneous Integration Roadmap (HIR). Designed to stimulate pre-competitive collaboration in order to advance heterogenous integration technology development and accelerate electronics innovation, HIR provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. SEMI is among five HIR sponsors. SEMI members across the global electronics supply chain integrate separately manufactured components into assemblies to enhance electronics system functionality across a multitude of applications.
Semiconductors
Graphene Substrate Improves the Conductivity of Carbon Nanotube Network
Transparent conductive films (TCFs) have many applications in touch screens, organic light emitting diodes and solar cells. These applications need materials that are strong, energy efficient and stable, which is why companies and researchers are interested in carbon-based materials. This applies especially to networks of single-walled carbon nanotubes, which are expected to replace the metal-oxide films that are currently used. In an article published in ACS Nano, scientists at Aalto University and the University of Vienna introduce a hybrid material made by combining carbon nanotubes and graphene, which improves the conductivity of the film beyond what is possible when using each of these component structures separately.
TSMC’s Leading-Edge Fab Investments Set Stage for Sale Surge in 2H19
Taiwan Semiconductor Manufacturing Company’s heavy investments in advanced wafer-fab technology are set to pay off significantly for the world’s largest silicon foundry as it continues the production ramp of 7nm ICs in the second half of this year, according to an analysis in IC Insights’ September Update to the 2019 McClean Report.
New Approach For Modern Power Grids That Increases Efficiency, Reduces Cost
Modern power grids are rapidly developing due to the increasing penetration of renewable energy sources such as solar photovoltaic and wind power. This trend is expected to rise in the near future, as attested by major countries worldwide in their commitments to the production of large renewable power penetration. A modern power grid, with its reduced dependence on non-renewable energy, has indisputable advantages in terms of environmental safeguards, but its introduction does not come without a cost.
MIPI Alliance Advances Activities for ADAS, ADS and Other Automotive Applications
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced key advancements and activities designed to enhance advanced driver assistance systems (ADAS), autonomous driving systems (ADS) and other automotive applications. Trends such as the proliferation of camera, display, radar, lidar and other sensors are creating growing demand for high-performance wired interfaces in vehicles. While drawing on its existing specifications for mobile devices, MIPI is developing and enhancing automotive specifications to meet the stringent requirements of automotive OEMs, Tier 1 suppliers, SoC designers and other industry providers in areas such as reliability, functional safety and low electromagnetic interference (EMI).
Patented Concept from Halle: Novel, High-Performance Diodes and Transistors
Physicists from Martin Luther University Halle-Wittenberg (MLU) have investigated if and how these materials might be developed. They have created, tested and filed a patent for a concept that utilises the latest findings from the field of spintronics. With their new concept, the researchers at MLU want to improve the properties of diodes and transistors. Common processors use thousands of diodes and transistors to process data.
2019 IEEE International Electron Devices Meeting to Shine the Spotlight on the Latest Advances in Semiconductors and Related Technologies
“Innovative Devices for an Era of Connected Intelligence” is the theme of the upcoming 2019 IEEE International Electron Devices Meeting (December 7-11, 2019), chosen to reflect the conference’s focus this year on the processors, memories, 3D architectures, power devices, quantum computing concepts and other technologies needed to drive diverse new applications of electronics technology forward. The 65th annual IEDM will feature a technical program of 238 papers given by many of the world’s top scientists and engineers in the field. It will be preceded by a series of 90-minute tutorials on Saturday, Dec. 7, and by day-long short courses on Sunday, Dec. 8.
SUTD Physicists Unlock the Mystery of Thermionic Emission in Graphene
Reporting in Physical Review Applied, researchers from the Singapore University of Technology and Design (SUTD) have discovered a general theory that describes the thermionic emission from graphene. By carefully studying the electronic properties of graphene, they have constructed a generalized theoretical framework that can be used to accurately capture the thermionic emission physics in graphene and is suitable for the modeling of a wide range of graphene-based devices.
The Honorable Kevin Rudd to Deliver Keynote Address at 2019 SIA Award Dinner
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced The Honorable Kevin Rudd, former prime minister of Australia and current president of the Asia Society Policy Institute, will deliver the keynote address at the 2019 SIA Award Dinner, which will take place on Thursday, Nov. 7 in San Jose, Calif. Rudd will offer insights on the future directions of the U.S.-China trade war, the risks of general economic decoupling, and implications for future collaboration in technology.
Nova’s President & CEO, Eitan Oppenhaim, Joins its Board of Directors
Nova (NASDAQ: NVMI), an innovator and key provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today the appointment of Eitan Oppenhaim, who has served as Nova’s President & Chief Executive Officer since 2013, to the company’s Board of Directors. “I am excited to join the board and have the opportunity to contribute to the team of directors,” commented Mr. Oppenhaim. “I am sure that this appointment, along with my continuous role as President and CEO, will contribute to the continuing success of our company.”
