Semiconductors

Renesas Electronics and 3db Access to Collaborate and Bring Secure Ultra-Wideband Solutions to Market

Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, and 3db Access AG, a fabless semiconductor company specializing in secure ultra-wideband (UWB) low power chips, jointly announced that Renesas will license 3db UWB technology and will collaborate to bring best-in-class secure access solutions to the connected smart home, Internet of Things (IoT), Industry 4.0, mobile computing, and connected vehicle applications. The collaboration combines each company’s technical leadership in performance, size reduction, ultra-low power consumption, and security to deliver breakthrough multi-receiver UWB solutions to the global market.

Five Semiconductor Companies Hold 53% of Global Wafer Capacity

Leaders in memory IC and foundry production maintain strongest capacity presence.

SEMI Industry Strategy Symposium Europe to Explore Tech’s Role in Meeting Region’s Most Pressing Needs

“ISS Europe is a powerful forum for identifying collaboration opportunities to strengthen Europe’s competitive advantage in the digital economy,” said Laith Altimime, president of SEMI Europe. “With the emergence of 5G, artificial intelligence (AI), augmented reality/virtual reality (AR/VR), quantum computing and other leading-edge technologies, the semiconductor industry is well-positioned to help drive the digital transformation for Europe’s societal and economic prosperity.”

David K. Lam to Unveil “Security Lithography” Advances to Thwart IC Counterfeiting at SPIE

Silicon Valley Hall of Famer and Founder of Lam Research to present unsurpassed levels of on-chip security enabled by Multicolumn E-beam Lithography (MEBL)

Powering the Future: Smallest All-Digital Circuit Opens Doors to 5nm Next-Gen Semiconductor

Scientists at Tokyo Institute of Technology (Tokyo Tech) and Socionext Inc. have designed the world’s smallest all-digital phase-locked loop (PLL). PLLs are critical clocking circuits in virtually all digital applications, and reducing their size and improving their performance is a necessary step to enabling the development of next-generation technologies.

Moving Precision Communication, Metrology, Quantum Applications From Lab to Chip

The field of photonic integration — the area of photonics in which waveguides and devices are fabricated as an integrated system onto a flat wafer — is relatively young compared to electronics.

Palomar Technologies Moves to New Global Headquarters, Expands Manufacturing Footprint to Meet Growth Goals and Customer Needs

Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging announced that to meet growing customer demand for its solutions around the world, it has moved to a new global headquarters and expanded its facilities to over 110,000 square feet.

‘Atomic Dance’ Reveals New Insights Into Performance of 2D Materials

A team of Northwestern University materials science researchers have developed a new method to view the dynamic motion of atoms in atomically thin 2D materials. The imaging technique, which reveals the underlying cause behind the performance failure of a widely used 2D material, could help researchers develop more stable and reliable materials for future wearables and flexible electronic devices.

Nanowires Made of Tellurium and Nanotubes Hold Promise for Wearable Tech

Wearable tech and electronic cloth may be the way of the future, but to get there the wiring needs to be strong, flexible and efficient. Boron nitride nanotubes (BNNT), studied by physicists at Michigan Technological University, encase tellurium atomic chains like a straw, which could be controllable by light and pressure. In collaboration with researchers from Purdue University, Washington University and University of Texas at Dallas, the team published their findings in Nature Electronics this week.

SEMI President and CEO Ajit Manocha Set for Induction into Silicon Valley Engineering Hall of Fame

Semiconductor industry veteran and SEMI president and CEO Ajit Manocha will be inducted into the Silicon Valley Engineering Hall of Fame on February 19, 2020. The Silicon Valley Engineering Council (SVEC) is honoring Manocha for championing industry collaboration and driving manufacturing efficiency in multiple leadership roles, as well as for his work as one of the pioneers of reactive ion etching and manufacturing process flows for logic and memory chips that serve as the foundation for modern microelectronics manufacturing.

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