The Series 49UL Thermal Management System with improved heater diagnostics capability and UL and CE safety certifications creates continuous heater monitoring and status, ensuring manufacturing process safety. With heater jackets made of high quality Polyimide or Polytetrafluoroethylene (PTFE), the S49UL provides high temperature operation and uniformity while being light weight and flexible for easy installation.
Semiconductors
Autotalks’ Chipset is Selected for the Company’s First Mass Production C-V2X Program in China
Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions, announced that its chipset was selected for a mass production C-V2X program in China, one of the first to be deployed in the huge Chinese market. This is the first mass-production C-V2X program for Autotalks, which consists of a Telematics Control Unit (TCU) with C-V2X powered by Autotalks’ chipset, built by a top Tier1 automotive provider.
2020 IEEE International Reliability Physics Symposium to Highlight Latest Research in Reliability for Semiconductor Devices, Microelectronic Systems, and Advanced Technologies
The upcoming 2020 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, will be held in Dallas, TX from March 29 – April 2, 2020 at the Hilton DFW Lakes Executive Conference Center. The Symposium will feature a number of special focus sessions highlighting novel and emerging areas of electronic reliability, as well as topics relating to conventional semiconductor, integrated circuit, and microelectronic assembly reliability.
Acquisition Rebound Lifts 2019 to Third-Largest M&A Year
Seven major semiconductor acquisition agreements valued at $1 billion or more increase the total value of all deals by 22% from the previous year, continuing the strong wave of M&A and consolidation among chip suppliers.
SemiQ Announces Next Generation 650V, 1200V, and 1700V Silicon Carbide Schottky Diode Family
SemiQ (previously Global Power Technologies Group) recently announced the release to production of its new 3rd generation SiC Diode Family featuring blocking voltages of 650V, 1200V and 1700V with forward-current starting at 8 amps up to 50 A per chip. Packages include TO-220-2L, TO-220-3L, TO-247-2L, TO-247-3L, SOT-227, TO-263 as well as bare die.
SEMI Talent Forum to Help Build Next-Generation Chip Industry Workforce
Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, 6 March 2020 in Swansea, UKat the University of Swansea. Sponsored by SEMI, the industry association representing the global electronics manufacturing and design supply chain, and staged in partnership with European organizations including the University of Swansea, Edwards, Oxford Instruments, and SPTS Technologies, the event will also highlight how technology is reshaping the global workforce. Participation is free of charge and registration is open.
Technology Trends in Semiconductors, Revealed by GlobalData
Semiconductors will enable the low latency, high bandwidth, pixel-heavy world soon to be spawned by the widespread deployment of 5G, but it will require a series of industry resets involving new architectures, business models, and materials. The central challenge is to process huge volumes of data a lot faster using a much lower power draw per bit stored, processed, and moved.
Semiconductor R&D To Nudge Higher Through 2024
The semiconductor business is defined by rapid technological changes and the need to maintain high levels of investment in research and development for new materials, innovative manufacturing processes for increasingly complex chip designs, and advanced IC packaging technologies.
Source Materials Enable the Evolution of the Ion-Implantation Process
Recent innovations in the field of new implant materials and innovative packaging are presented.
Scaling the BEOL: A Toolbox Filled with New Processes, Boosters and Conductors
Extending interconnects towards the 3nm technology node and beyond requires several innovations. Imec sees single-print EUV in dual-damascene modules, Supervia structures, semi-damascene modules and added functionality in the back-end-of-line (BEOL) as the way forward.
