Imec, a research and innovation hub in nanoelectronics, digital and energy technologies and partner in EnergyVille, announced a solid-state Li-metal battery cell with an unsurpassed energy density of 400 Wh/liter at a charging speed of 0.5C
Semiconductors
CMP Materials Market Reaches $2.7B Amid Signs of Orders Slowing in 2019
TECHCET announced that the global market for chemical-mechanical planarization (CMP) consumable materials in semiconductor manufacturing is forecasted to grow to US$2.7 billion in 2019. However, several suppliers report softening orders for the first half of 2019 due to shifting wafer starts combined with intensified industry efforts to save slurry costs through increasing dilution.
Can We Believe The Hype About China’s Domestic IC Production Plans?
Tariffs and trade issues are forcing China to scale its domestic IC production plans, but do its claims line up with reality? IC Insights believes they do not.
Purdue and World’s Largest Semiconductor Manufacturer Collaborate To Research Secured Microelectronics Ecosystem
Purdue University and TSMC jointly announced plans Wednesday (June 12) to establish a Center for Secured Microelectronics Ecosystem aimed at ensuring a secure supply of semiconductor chips and related tools all the way from the foundry to the packaged system. The center, to be located at the Purdue University West Lafayette, Indiana campus, will perform research to ensure a secure ecosystem for the manufacture of microelectronics systems.
Ultra-Low Power Chips Help Make Small Robots More Capable
An ultra-low power hybrid chip inspired by the brain could help give palm-sized robots the ability to collaborate and learn from their experiences. Combined with new generations of low-power motors and sensors, the new ASIC could help intelligent swarm robots operate for hours instead of minutes.
GLOBALFOUNDRIES and Soitec Announce Multiple Long-term SOI Wafer Supply Agreements
GLOBALFOUNDRIES (GF) and Soitec announced that they have signed multiple long-term supply agreements for 300mm silicon-on-insulator (SOI) wafers to secure the high-volume supply to meet the growing demand from GF customers for its differentiated radio-frequency-silicon-on-insulator (RF-SOI), fully-depleted-silicon-on-insulator (FD-SOI) and silicon photonics technology platforms. The agreements, which take effect immediately, build on the existing close relationship between the companies to ensure state-of-the-art high-volume manufacturing for years to come. Through industry leadership…
Small Currents For Big Gains In Spintronics
UTokyo researchers have created an electronic component that demonstrates functions and abilities important to future generations of computational logic and memory devices.
Imec Demonstrates Optimized Process Flows For High Performance Ge-Based Devices
Today, at the 2019 Symposia on VLSI Technology and Circuits (June 9-14, 2019), imec, a research and innovation hub in nanoelectronics and digital technologies, reports improved performance for both Ge-based n-type FinFETs and Ge-based p-type gate-all-around (GAA) devices. For Ge n-type FinFETs, pre-gate stack process optimization dramatically improved reliability and performance, with 100 percent improvement in positive bias temperature instability (PBTI) and improvement in GmSAT vs. SSSAT benchmark. For the Ge-based p-type GAA device,…
Antennas Of Flexible Nanotube Films An Alternative For Electronics
Rice University lab claims a viable competitor for copper in 5G wireless and other applications.
Researchers ‘Stretch’ The Ability of 2D Materials To Change Technology
University of Rochester researchers have combined 2D materials with oxide materials in a new way, using a transistor-scale device platform, to fully explore the capabilities of these changeable 2D materials to transform electronics, optics, computing and a host of other technologies.
