Surprising behavior could safeguard information stored in quantum bits
Semiconductors
Detraction-Free Light-Matter Interaction
An efficient light-matter interface might constitute the foundation of quantum communication. However, certain structures that are formed during the growth process interfere with the signal.
Can’t Get Thinner Than This: Synthesis of Atomically Flat Boron Sheets
Since its rediscovery and characterization in 2004, graphene has been the focus of countless research efforts across multiple fields. It is a very versatile material consisting of a two-dimensional (2D) carbon network; in other words, it comprises a thin sheet of carbon that has a thickness of one atom. Graphene is not only stronger than the strongest steels, but also has a myriad of interesting chemical, electronic, and mechanical characteristics…
North American Semiconductor Equipment Industry Posts July 2019 Billings
Total billings of North American equipment manufacturers for July were slightly up over June billings.
New Study Reveals Carbon Nanotubes Measurement Possible For the First Time
Experiments yield conductivity measurements between two identical carbon nanotubes.
AKHAN Semiconductor, Inc. Issued Key Patent in Korea
Patent covers method for fabrication of diamond semiconductor materials.
Trymax Receives Order from a Leading-Edge Photonics Research Organization
Eindhoven University of Technology (TU/e) acquires a plasma solution from Trymax.
2019 IEEE International Electron Devices Meeting to Highlight Innovative Devices for an Era of Connected Intelligence
The upcoming 65th annual IEEE International Electron Devices Meeting (IEDM), to be held December 7-11, 2019 at the Hilton San Francisco Union Square hotel, will once again feature the latest and most important research taking place in semiconductors and other electron devices, but with a sharper focus this year on devices intended to support diverse new applications.
SIA Statement Following Commerce’s Announcement to Extend the Temporary General License
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following statement from SIA President & CEO John Neuffer following the Department of Commerce announcement adding Huawei affiliates to the entities list and providing an extension of the Temporary General License until November 2019.
Creating Customer Value: A Case Study on 300mm Manufacturing Learning for Back Qualification of 200mm Processing
The cost of many 300mm chemical Mechanical Planarization (CMP) consumables has decreased in recent years due to a maturing market and new process learning, making it economically feasible to embark on a new 200mm Oxide CMP polishing process based on these advanced commercial consumables in the market, today.
