Semiconductors

First Quarter 2019 Worldwide Semiconductor Equipment Billings Drop 19% Year-Over-Year

SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported that worldwide semiconductor manufacturing equipment billings for the first quarter of 2019 dropped 8 percent from the previous quarter and 19 percent from the same quarter in 2018 to US$13.8 billion. The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 80 global equipment companies that provide data on a monthly…

Ultra-Clean Fabrication Platform Produces Nearly Ideal 2D Transistors

Columbia engineers develop a clean, damage-free fabrication process that creates pristine transistors made from 2D material stacks. Testing additional content. Testing additional content. Testing additional content.

TSI Introduces New AeroTrak-Plus Remote Airborne Particle Counters

TSI (Shoreview, MN) has introduced a new range of AeroTrak®+ Remote Airborne Particle Counters (APCs)…

Synopsys Fusion Design Platform First to be Certified by Samsung Foundry for 5LPE Process with EUV Technology

Synopsys, Inc. (Nasdaq: SNPS) today announced that Samsung Electronics has certified the Synopsys Fusion Design Platform™ for Samsung’s 5-nanometer…

MACOM Announces Stephen G. Daly as President and Chief Executive Officer

MACOM Technology Solutions Holdings, Inc. (“MACOM”) (NASDAQ: MTSI), a supplier of semiconductor solutions, today announced the…

After Three Consecutive Years of Growth, IDC Forecasts Worldwide Semiconductor Revenue to Decline by 7.2% in 2019

After three consecutive years of growth, with year-over-year growth of 13.2% in 2018, the latest…

AKHAN Semiconductor Appoints H. Delano Roosevelt to Board of Directors; Robert Mohr Named CFO

AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronic-grade diamonds,…

Toshiba Memory and Western Digital to Jointly Invest in Flash Manufacturing Facility in Kitakami, Japan

Toshiba Memory Corporation and Western Digital Corp. have finalized a formal agreement to jointly invest in the “K1” manufacturing facility that Toshiba Memory is currently constructing in Kitakami, Iwate Prefecture, Japan.

MACOM Announces John F. Kober as Senior Vice President and CFO

MACOM Technology Solutions Holdings, Inc. (“MACOM”) (NASDAQ: MTSI), a supplier of semiconductor solutions, today announced the…

CEA-Leti and Silvaco Team Up on Yield-Prediction Project For Ultra-Low-Power Static Memories

Leti, a research institute of CEA-Tech, and Silvaco Inc., a global provider of software, IP…

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