To increase the efficiency of microchips, 3D structures are now being investigated. However, spintronic components, which rely on electron spin rather than charge, are always flat. To investigate how to connect these to 3D electronics, University of Groningen physicist Dr. Kumar Sourav Das created curved spin transport channels. Together with his colleagues, he discovered that this new geometry makes it possible to independently tune charge and spin currents.
Semiconductors
Spying on Topology
Topological insulators are quantum materials, which, due to their exotic electronic structure, on surfaces and edges conduct electric current like metal, while acting as an insulator in bulk. Scientists from the Max-Born Institute for Nonlinear Optics and Short Pulse Spectroscopy (MBI) have demonstrated for the first time how to tell apart topological materials from their regular – trivial – counterparts within a millionth of a billionth of a second by probing it with ultra-fast laser light.
Catherine Failliet, Seasoned Industry Leader in Water and Energy Industries, Joins Kerlink’s Board of Directors
Kerlink, a specialist in solutions dedicated to the Internet of Things (IoT), today announced Catherine Failliet’s appointment to its board of directors. Failliet brings more than 25 years of senior executive experience in business development and project management in water and energy systems and smart-city programs to Kerlink’s board.
Toshiba Memory Today Rebrands As “Kioxia”
Kioxia Holdings Corporation, formerly Toshiba Memory Holdings Corporation, today announced that it is officially operating under its new corporate identity, effective immediately.
SEMICON Japan 2019 to Spotlight Smart Technology, Innovation, Promise of Smarter World
Spanning the entire electronics value chain, SEMICON Japan 2019 will gather industry visionaries to explore strategies for creating an even smarter world as the event sets its sights on the latest developments and trends in robotics, 5G mobile communications, Smart Manufacturing, Smart cars and other Smart applications. December 11-13 at Tokyo Big Sight in Tokyo, SEMICON Japan is the largest and most influential exhibition in Japan for the electronics manufacturing supply chain. Registration for SEMICON Japan 2019 is now open.
Plasma-Therm Announces Cooperation with Everspin Technologies Inc.
Everspin Technologies, Inc. has entered into an agreement with Plasma-Therm, allowing Everspin to use the 8-inch Pinnacle Ion Beam Etch System for advanced STT-MRAM materials and etch development in conjunction with their Chandler 8-inch facility.
Total Wafer Shipments to Drop 6 Percent in 2019, Resume Growth in 2020, Set New High in 2022
Total wafer shipments in 2019 are expected to decline 6 percent from last year’s historic high, with growth resuming in 2020 and shipments reaching a new high in 2022, according to SEMI’s recent semiconductor industry annual silicon shipment forecast. Forecast demand for silicon units through 2022 shows polished and epitaxial silicon shipments totaling 11,757 million square inches in 2019, 11,977 million square inches in 2020, 12,390 million square inches in…
CCNY Physicists Score Double Hit in LED Research
In two breakthroughs in the realm of photonics, City College of New York graduate researchers are reporting the successful demonstration of an LED (light-emitting diode) based on half-light half-matter quasiparticles in atomically thin materials. This is also the first successful test of an electrically driven light emitter using atomically thin semiconductors embedded in a light trapping structure (optical cavity).
Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements
Synopsys, Inc. (Nasdaq: SNPS) today announced it has achieved certification for dozens of new, innovative features to the Synopsys Digital and Custom Design Platforms on TSMC’s most advanced 5nm process technology, required for high-performance computing (HPC) and mobile chip designs. In addition to certification of HPC and mobile design flows, Synopsys has also achieved the certification for its design tools on TSMC’s industry-leading N5P and N6 process technologies, enabling early customer design work.
Renesas Electronics and StradVision Collaborate on Smart Camera Development for Next-Generation ADAS
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and StradVision, Inc., a vision processing technology solutions provider for autonomous vehicles with expertise in deep learning, today announced the joint development of a deep learning-based object recognition solution for smart cameras used in next-generation advanced driver assistance system (ADAS) applications and cameras for ADAS Level 2 and above.