Toshiba Memory Corporation and Western Digital Corp. have finalized a formal agreement to jointly invest in the “K1” manufacturing facility that Toshiba Memory is currently constructing in Kitakami, Iwate Prefecture, Japan.
Semiconductors
MACOM Announces John F. Kober as Senior Vice President and CFO
MACOM Technology Solutions Holdings, Inc. (“MACOM”) (NASDAQ: MTSI), a supplier of semiconductor solutions, today announced the appointment of John F. Kober as Senior Vice President and Chief Financial Officer, effective immediately. Mr. Kober has over 25 years of accounting and finance experience, and has served as MACOM’s Vice President and Corporate Controller since 2015. Prior to that, he served as Vice President, Corporate Controller and Treasurer at CIRCOR International Inc. (NYSE:…
CEA-Leti and Silvaco Team Up on Yield-Prediction Project For Ultra-Low-Power Static Memories
Leti, a research institute of CEA-Tech, and Silvaco Inc., a global provider of software, IP and services for designing chips and electronic systems for semiconductor companies, today announced, during the 56th Design Automation Conference (DAC) in Las Vegas, a project to estimate and model the yield of ultra-low-voltage (ULV), ultra-low-leakage (ULL) static random access memory (SRAM) used in computing applications. Accurate yield prediction in the early stage of the IC design…
Global Semiconductor Alliance Launches Initiative to Bolster Women’s Leadership
The Global Semiconductor Alliance (GSA) today unveiled its Women’s Leadership Initiative (WLI), seeking to significantly increase the number of women entering the semiconductor market, as well as elevating their participation as founders, leaders and board members. As part of this initiative, the GSA has established the WLI Council that will create and implement programs and projects towards meeting the WLI objectives. “The WLI Council is passionate about increasing the number of women in…
Carnegie Mellon Researchers Create Soft, Flexible Materials With Enhanced Properties
A team of polymer chemists and engineers from Carnegie Mellon University have developed a new methodology that can be used to create a class of stretchable polymer composites with enhanced electrical and thermal properties.
Call For SEMICON WEST 2019 “Best Of West” Award Applications
SEMI is accepting SEMICON West 2019 exhibitor applications for the Best of West award recognizing innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability. The application deadline for the Best of West award, presented annually by Semiconductor Digest magazine and SEMI Americas, is June 14. Exhibitors can apply using the online submission form. Best of West award winners will be announced July 10 at SEMICON West 2019, July…
CEA-Leti Develops CMOS Process for High-Performance MicroLEDs That Could Overcome Display-Size Obstacles
Leti, a research institute of CEA Tech, recently announced a new technology for fabricating GaN microLED displays for applications ranging from smart watches to TVs with no size limit. The approach fabricates elementary units of all-in-one red, green, blue (RGB) microLEDs on a CMOS driving circuit, and transfers the devices to a simple receiving substrate. The units are fabricated with a full semiconductor, wafer-scale approach. “This new process, in the proof-of-concept…
Semiconductor Leaders Strike Agreement on Global Policy Agenda
The Semiconductor Industry Association welcomed a policy agreement reached by global semiconductor industry leaders at the 23rd annual meeting of the World Semiconductor Council this week in Xiamen, China.
Silicon Reclaim Wafer Market Logs Second Year of Strong Growth but Softening Ahead
Logging a second consecutive year* of strong growth, the silicon wafer reclaim market surged 19 percent to $603 million in 2018 on the strength of a record number of reclaimed wafers processed, SEMI, the industry association representing the global electronics manufacturing and design supply chain, reported in its 2018 Silicon Reclaim Wafer Characterization Summary. Growth, however, is forecast to taper off with the market expanding to $633 million by 2021. The 2018 total is well below…
IEEE International Electron Devices Meeting Announces 2019 Call for Papers
The 65th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union Square hotel December 7–11, 2019, has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development. The paper submission deadline this year is Friday, July 26, 2019. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. Only a very small…
