Designed to bridge the gap between the engineering and production phases, this advanced handler offers unprecedented flexibility, reliability, and energy efficiency for final test operations, setting a new standard for semiconductor testing.
Semiconductors
Solution to a Decade-Old Problem Will Free Up Quantum Computing Power
University of Sydney quantum researchers Dominic Williamson and Nouédyn Baspin have revealed a transformative new architecture for managing errors that emerge in the operation of quantum computers.
NexGen Wafer Systems Introduces SERENO
NexGen Wafer Systems announced the launch of SERENO, its latest multi-chamber platform designed for Wet Etch and Clean applications.
Junkosha Launches Custom Cable Solution at SEMICON Europa
Junkosha has chosen SEMICON Europa to announce the launch of its EPTFE Flat Cable designed for critical components in manufacturing and inspection equipment.
Atomically Thin Memory Resistors Will Optimize Semiconductors for Neuromorphic Computing
A joint project between University of Kansas and University of Houston supported by $1.8 million from the National Science Foundation’s second Future of Semiconductor program (FuSe2) will produce atomically tunable memory resistors.
Biden-Harris Administration Announces Preliminary Terms with Corning and Powerex to Support U.S. Supply Chain Resiliency
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed two separate preliminary memoranda of terms (PMT) under the CHIPS and Science Act to provide Corning up to $32 million in proposed direct funding and Powerex up to $3 million in proposed direct funding.
Dr. Ann B. Kelleher Named Dr. Lisa Su Woman of Innovation Award Recipient at WISH Conference
The Global Semiconductor Alliance (GSA) Women’s Leadership Initiative (WLI) announced the recipient of the 2024 Dr. Lisa Su Woman of Innovation Award: Dr. Ann B. Kelleher from Intel Corporation.
FormFactor and Advantest Partner on Silicon Photonics Wafer-Level Test Cell to Enable High-Volume Manufacturing
FormFactor, Inc. and Advantest Corporation announced today a strategic partnership to develop a novel test cell and measurement system designed for high-volume production of silicon photonics (SiPh) and co-packaged optics (CPO) devices.
Fabrication of 4-inch Wafer-Scale Heterostructure via PECVD
KIMM achieves world’s first large-area semiconductor fabrication with TMDc and graphene heterostructure.
New PFAS Removal Process Aims to Stamp Out Pollution Ahead of Semiconductor Industry Growth
A University of Illinois Urbana-Champaign study is the first to describe an electrochemical strategy to capture, concentrate and destroy mixtures of diverse chemicals known as PFAS — including the increasingly prevalent ultra-short-chain PFAS — from water in a single process.
