Flip chip technology makes it possible to replace conventional wire interconnections with a direct and strong bond between chips and substrates. The future of silicon packaging is anticipated to be significantly influenced by flip chip technology to satisfy the increasing need for electronics that are faster, smaller, and more efficient.
Semiconductors
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
Research published in Nature demonstrates high qubit control fidelity and uniformity in single-electron control.
Purdue-Created Technology Makes 3D Microscopes Easier to Use, Less Expensive to Manufacture
3D microscopes are used in applications from the life sciences to semiconductor manufacturing. Now Purdue engineers are developing patented and patent-pending innovations making them work faster to capture even more 3D images and less expensive to manufacture.
Morse Micro Expands Presence in Taiwan with New Office
Morse Micro today announced the official opening of its new Taiwan branch.
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
Worldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024.
Women MAKE Awards Recognizes GlobalFoundries’ Jennifer Robbins and Katelyn Harrison for Manufacturing Excellence
Last week, the Manufacturing Institute (MI)—the workforce development and education affiliate of the National Association of Manufacturers—honored two outstanding women from GlobalFoundries at their annual Women MAKE Awards
AMD’s Dr. Lisa Su Named Chief Executive Magazine’s 2024 CEO of the Year
Chief Executive magazine today announced that Dr. Lisa Su, CEO of AMD, has been named 2024 Chief Executive of the Year by her peer CEOs.
Gstar Announces Groundbreaking of Silicon Wafer Factory Construction in Indonesia
Recently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
Guerrilla RF Completes Strategic Acquisition of GaN Device Portfolio from Gallium Semiconductor
Guerrilla RF, Inc. has finalized the acquisition of Gallium Semiconductor’s entire portfolio of GaN power amplifiers and front-end modules.
Design Strategies Toward Plasmon-Enhanced 2-Dimensional Material Photodetectors
A research group from Southeast University provided a detailed overview of plasmon-enhanced 2D material photodetectors, mainly focusing on the clarification of different hybridization modes between plasmonic nanostructures and 2D materials.
