A group of Korean researchers have recently succeeded in developing new p-type semiconductor materials and thin-film transistors that will lead the innovation of the semiconductor industry.
Semiconductors
Heidelberg Instruments Reports Several Installations of its ULTRA Semiconductor Mask Writer as Global Semiconductor Demand Surges
Heidelberg Instruments, a provider of advanced laser lithography systems, is pleased to announce a continued stream of orders for the ULTRA Semiconductor Mask Writer from photomask production groups across the US and Asia.
Polymatech and ECM Group Forge Strategic Joint Venture for Semiconductor Wafer Fabrication in Grenoble, France
The new venture will focus on producing sapphire ingots and wafers, key materials for advanced semiconductor devices.
What’s in the August/September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the August/September issue.
Infineon Pioneers World’s First 300mm Power GaN Technology
Infineon Technologies AG today announced that the company has succeeded in developing the world’s first 300mm power gallium nitride (GaN) wafer technology.
Material Export Restrictions Poised to Strain Semiconductors
TECHCET has identified a potential strain on US semiconductor manufacturing capability as Chinese export restrictions on key materials have been announced.
Samtec Orders ClassOne Technology Solstice S8 Single-Wafer System to Process Glass Core Technology Products
ClassOne Technology, a global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has received an order from new customer Samtec for a Solstice S8 single-wafer processing system.
JEDEC Publishes Essential Test Method to Address Switching Energy Loss in Wide Bandgap and Silicon Semiconductor Power Devices
JEDEC Solid State Technology Association today announced the publication of JEP200: Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices.
NXP Combines Ultra-Wideband Secure Ranging and Short-Range Radar to Enable Autonomous Industrial and IoT Applications
NXP Semiconductors N.V. today announced the Trimension SR250, the industry’s first single-chip solution that integrates on-chip processing capabilities with both short-range UWB radar and secure ranging.
Intel Names New Representative to Si2 Board
Intel has a new representative on the Silicon Integration Initiative board of directors.
