In addition to the regular work on profiles for the semiconductor industry, the group also took time to look back on the successes of the working group since it was founded in 2011.
Semiconductors
Biden-Harris Administration Announces Preliminary Terms with GlobalWafers
The proposed CHIPS investment would support the construction of new wafer manufacturing facilities and the creation of 1,700 construction jobs and 880 manufacturing jobs.
How Etch Breakthroughs Are Tackling 3D NAND Scaling Challenges on the Path to 1,000 Layers
As the industry now looks towards the 1,000-layer roadmap by the end of decade or soon thereafter, there are some critical challenges. Lam is working actively with leading customers to address these in time through innovations in etch, as well as other advanced manufacturing processing steps.
Power SiC WFE Market: Yole Group Forecasts the CapEx Trend
With multiple investments announced by players, the Power SiC wafer front-end equipment market will peak at $5 billion in 2026. Besides the strong growth in the tool market, there are some concerns about future over-capacity and manufacturing challenges for technology transition.
New Processes and Priorities Pose New SubFab Challenges
New process trends are creating new challenges for the equipment in the subfab, particularly vacuum pumps and gas abatements systems that must now handle new types of materials and their process byproducts, and at greater volumes
Wafer Fab Equipment: 2024 Revenue Holds Steady, Poised for 2025 Surge
Yole Group announces a 2024 revenue (calendar year) to increase by 1.3% year-on-year, reaching $108.1 billion, despite a 12% quarter-to-quarter drop in Q1 2024.
Optimizing Risk Mitigation in the Fab and Sub-Fab
Service is starting to come into the risk mitigation category, said Alex Smith, Vice President of Marketing, Semiconductor Service at Edwards.
KLA: 40 Years of Broadband Plasma Inspection
Broadband plasma inspectors use advanced optical and data processing technologies to discover critical defects on patterned wafers during chip manufacturing.
Bechtel: Now Is the Time for Digital Integration
We recently caught up with Dr. Evann Smith, the digital solutions manager for Bechtel’s Manufacturing & Technology business unit where they lead the strategic development and deployment of the digital ecosystem.
Edwards: How Cryogenics and High-Speed Vacuum Pumps Enable High Aspect Ratio Etch
Edwards has a new cryogenic chiller called Polycold that provides cryogenic wafer chuck cooling. The company also announced a new line of turbopumps.
