Today’s computers reach their physical limits when it comes to speed. Semiconductor components usually operate at a maximum usable frequency of a few gigahertz – which corresponds to several billion computing operations per second.
Semiconductors
Paul V. Walsh, Jr. Joins Kopin Corporation Board of Directors
Kopin Corporation today announced that Paul V. Walsh, Jr. has joined Kopin Corporation’s Board of Directors.
GlobalFoundries and Silicon Catalyst Partner to Accelerate Differentiated Technology Solutions for Semiconductor Startups
GlobalFoundries and Silicon Catalyst, the world’s only incubator+accelerator focused exclusively on semiconductor solutions, today announced that GF has joined the incubator’s semiconductor startup ecosystem as a Strategic Partner and an In-Kind Partner (IKP).
Brooks Instrument Celebrates New Manufacturing Site in Malaysia
Grand opening for the company’s fourth manufacturing facility highlights production and partnership opportunities with key customers in the Asia-Pacific region.
Entegris Appoints Mary Puma to Board of Directors
Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, today announced the appointment of Mary Puma to its board of directors.
ROHM and UAES Sign a Long-Term Supply Agreement for SiC Power Devices
ROHM Semiconductor and United Automotive Electronic Systems Co., Ltd. (UAES), a Tier 1 automotive supplier in China, today announced they have entered into a long-term supply agreement for SiC power devices.
DELO Introduces New Microelectronics Adhesive for Ultra-Fine Structures
DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds.
Applied Materials Appoints Florent Ducrot as Head of European Operations
Applied Materials, Inc. today announced Florent Ducrot, Vice President and General Manager, to serve as the Head of European Operations.
ACM Research Receives Orders for Wafer-Level Packaging Tools from U.S. Customer and R&D Center
ACM Research, Inc. today announced it has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center.
Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same period.
