Adeia Inc. today announced Dr. Belgacem Haba, a renowned innovator in microelectronics packaging and integration technologies, has recently received his 600th issued U.S. patent.
Semiconductors
Daniel Cross of Cadence Wins Si2 Pinnacle Award
Daniel Cross, senior principal solutions engineer at Cadence Design Systems, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award, recognizing volunteers for professional contributions to Si2’s success as a leading semiconductor research and development joint venture.
Oxford Instruments Asylum Research Receives R&D 100 and Frost & Sullivan Awards for its Vero Atomic Force Microscope
Oxford Instruments Asylum Research announced today that its next-generation Atomic Force Microscope (AFM), Vero, has received three prestigious awards.
NSF Awards $38M to Strengthen Research Infrastructure
The U.S. National Science Foundation has awarded researchers in Maine, Mississippi, New Mexico, Puerto Rico and Rhode Island roughly $38 million through the Established Program to Stimulate Competitive Research (EPSCoR), which promotes the development of research competitiveness among 28 targeted states and territories, called jurisdictions.
Fujitsu Semiconductor Memory Solution Announces Change in Its Name to RAMXEED LIMITED
Fujitsu Semiconductor Memory Solution Limited is pleased to announce that the company name will change to RAMXEED LIMITED, effective January 1, 2025.
TSMC Breaks Ground, Secures Subsidy for German Plant
The Taiwan Semiconductor Manufacturing Company (TSMC) has begun work on a 10-billion-euro plant in Dresden as the European Union approves state assistance for the project.
Diraq Drives Two-Qubit Gate Accuracy in CMOS to Above 99%
Diraq announced it has successfully demonstrated consistent and repeatable operation with above 99% fidelity of two-qubit gates in the SiMOS (silicon metal-oxide-semiconductor) quantum dot platform.
OKI Sets Up New PCB Manufacturing Line for Semiconductor Manufacturing and Testing Equipment at Joetsu Plant
The OKI Group PCB business company OKI Circuit Technology has set up a new ultra-high-multilayer PCB line at the Joetsu Plant in Joetsu City, Niigata Prefecture, with full-scale operations commencing in July.
Global Semiconductor Manufacturing Industry Strengthens in Q2 2024, SEMI Reports
The global semiconductor manufacturing industry in the second quarter of 2024 continued to show signs of improvement with significant growth of IC sales, stabilizing capital expenditure, and an increase in installed wafer fab capacity, SEMI announced today
2025 IEEE Electronic Components and Technology Conference Announces Call for Papers
The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a Call for Papers for ECTC 2025, the conference’s 75th anniversary.
