LA9300AD enables detection of shallow microscopic defects, contributing to reduced manufacturing costs and improved yield.
Semiconductors
Adeia Chooses Veeco to Accelerate Next-Generation Advanced Packaging Applications
Veeco Instruments Inc. today announced that Adeia Inc., a semiconductor R&D innovator has chosen the WaferStorm Wet Processing Systems for advanced packaging applications.
Global Semiconductor Materials Market Set to Achieve Record Highs
TECHCET forecasts a rebound in the global semiconductor materials market this year.
Intel Appoints Stacy Smith to Board of Directors
Intel Corporation today announced that Stacy Smith, executive chairman of Kioxia Corporation, formerly Toshiba Memory Corporation, and chair of Autodesk Inc., was appointed to Intel’s board of directors, effective immediately. Smith will serve as an independent director and join the board’s Audit & Finance Committee.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
SemiQon Announces Shipping of its Silicon-Based 4-qubit Quantum Chip and Transistors
Research groups around the world are now using these first-generation silicon-based chips helping the industry step faster to the million qubit level of quantum computing.
Brooks Instrument Introduces New Mass Flow Controllers for High-Temperature Environments
Brooks Instrument has released its new GF120xHT Series high-temperature thermal mass flow controller.
Silicon Box Announces $3.6B Investment For Expansion Into Italy
Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility.
Micron Appoints Robert Swan to its Board of Directors
Micron Technology, Inc. today announced the appointment of Robert (Bob) Swan to its board of directors.
TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preforms
Contributing to technical innovation in optical and digital devices by solving the need for greater miniaturization and higher density mounting of semiconductors.
