SEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum technology hardware and software products, today announced a Distribution Agreement with Okaya Electronics Corp. (“Okaya”), a leading Japanese semiconductor distributor company headquartered in Tokyo.
Semiconductors
Weebit Nano Demonstrates Performance of its ReRAM Under Extended Automotive Conditions
Weebit Nano Limited, a developer of advanced memory technologies for the global semiconductor industry, is demonstrating the high endurance and reliability of its Resistive Random-Access Memory (ReRAM) in extended automotive conditions, including high temperatures of 150 degrees Celsius and extended program cycles.
Sony Semiconductor Israel Announces Commercial Availability of the Revolutionary ALT1350 LPWA Chipset
The new ALT1350, a game-changer for asset trackers and smart utility meters, boasts unmatched low power consumption and advanced location capabilities.
Aerotech Invests in Korean Manufacturing Facility
Aerotech Inc., a global leader in precision motion control and automation, is expanding its partnership with Korean distributor ANI Motion Tech.
TECHCET Welcomes Mike Walden as New Senior Director
TECHCET announced Mike (Michel) Walden as the new Senior Director of Market Research and Analytics for TECHCET.
Researchers Invent New Way to Stretch Diamond for Better Quantum Bits
A future quantum network may become less of a stretch, thanks to researchers at the University of Chicago, Argonne National Laboratory and Cambridge University.
SIA Commends CHIPS Act Incentives for GlobalFoundries Projects
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and GlobalFoundries.
GlobalFoundries and Biden-Harris Administration Announce CHIPS and Science Act Funding for Essential Chip Manufacturing
$1.5 billion potential investment will support the expansion of GlobalFoundries New York facility, including construction of a new state-of-the art fab, and the modernization of its Vermont facility, adding secure capacity for essential chip manufacturing for automotive and other key markets.
HKUST Researchers Develop New Integration Technique for Efficient Coupling of III-V and Silicon
Researchers at the Hong Kong University of Science and Technology (HKUST) have developed a new integration technique for efficient integration of III-V compound semiconductor devices and silicon, paving the way for photonic integration at low cost, large volume, and high speed and throughput that could revolutionize data communications.
Semiconductor Revenue Forecast
After decline of -13%, TECHCET reports consecutive YoY double-digit growth.
