Technological advancements and market dynamics propel the CIS industry forward.
Semiconductors
System-Level Simulations, Sub-System Digital Twins, 2.5D Heterogeneous Integration, UCIe and CMOS 2.0
Chip design simulation remains an important tool, but manufacturing and supply chain simulators are equally critical – e.g., digital twins and chiplets. Die hardware integration security looks to be the new threat target for modern systems, and CMOS 2.0 may make the challenge even more significant.
Chips Joint Undertaking and Republic of Korea Initiate Groundbreaking Semiconductor Collaboration
This partnership aims to foster technological advancements, enhance supply chain resilience, and secure a leading position in the global semiconductor industry.
EtherCAT Technology Group’s Semiconductor Working Group Hosts 25th Meeting in Silicon Valley
In addition to the regular work on profiles for the semiconductor industry, the group also took time to look back on the successes of the working group since it was founded in 2011.
Biden-Harris Administration Announces Preliminary Terms with GlobalWafers
The proposed CHIPS investment would support the construction of new wafer manufacturing facilities and the creation of 1,700 construction jobs and 880 manufacturing jobs.
How Etch Breakthroughs Are Tackling 3D NAND Scaling Challenges on the Path to 1,000 Layers
As the industry now looks towards the 1,000-layer roadmap by the end of decade or soon thereafter, there are some critical challenges. Lam is working actively with leading customers to address these in time through innovations in etch, as well as other advanced manufacturing processing steps.
Power SiC WFE Market: Yole Group Forecasts the CapEx Trend
With multiple investments announced by players, the Power SiC wafer front-end equipment market will peak at $5 billion in 2026. Besides the strong growth in the tool market, there are some concerns about future over-capacity and manufacturing challenges for technology transition.
New Processes and Priorities Pose New SubFab Challenges
New process trends are creating new challenges for the equipment in the subfab, particularly vacuum pumps and gas abatements systems that must now handle new types of materials and their process byproducts, and at greater volumes
Wafer Fab Equipment: 2024 Revenue Holds Steady, Poised for 2025 Surge
Yole Group announces a 2024 revenue (calendar year) to increase by 1.3% year-on-year, reaching $108.1 billion, despite a 12% quarter-to-quarter drop in Q1 2024.
Optimizing Risk Mitigation in the Fab and Sub-Fab
Service is starting to come into the risk mitigation category, said Alex Smith, Vice President of Marketing, Semiconductor Service at Edwards.
