Broadband plasma inspectors use advanced optical and data processing technologies to discover critical defects on patterned wafers during chip manufacturing.
Semiconductors
Bechtel: Now Is the Time for Digital Integration
We recently caught up with Dr. Evann Smith, the digital solutions manager for Bechtel’s Manufacturing & Technology business unit where they lead the strategic development and deployment of the digital ecosystem.
Edwards: How Cryogenics and High-Speed Vacuum Pumps Enable High Aspect Ratio Etch
Edwards has a new cryogenic chiller called Polycold that provides cryogenic wafer chuck cooling. The company also announced a new line of turbopumps.
SCREEN Focuses on Sustainability, New Coat/Develop Track Systems
SCREEN offers a diverse range of systems, from its flagship models for 300mm wafers, offering high functionality and superior productivity for the cutting-edge device market, to 200mm and under models that handle wafers of various sizes and shapes for the IoT device market
Silicon Photonics Light the Way Toward Large-Scale Applications in Quantum Information
Silicon-based frequency-entangled qubits enable secure quantum information distribution across a five-user quantum network without the need for trusted nodes.
Inorganic Ventures acquires PURE Analytical Laboratories
IV Labs Inc, the parent company of Inorganic Ventures, has acquired PURE Analytical Laboratories in a move to produce materials with higher purities than currently available and to create new, high-purity materials for emerging applications from semiconductors and computing to pharmaceuticals and diagnostic equipment.
Intel Launches Its First US Apprenticeship for Manufacturing Facility Technicians
The program will train facility technician apprentices over the next five years in Arizona.
Aitomatic Unveils SemiKong: AI Breakthrough Set to Reshape $500B Semiconductor Industry
Unveiled at SEMICON West 2024, SemiKong aims to revolutionize semiconductor processes and fabrication technology, potentially reshaping the $500B semiconductor industry in the next five years.
Adeia Wins ECTC Award for Paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
Adeia Inc. was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on May 28-31, 2024.
SEALSQ RISC-V Semiconductors is Pioneering Sustainability Through Decentralized Processing
SEALSQ Corp announces the breakthrough adoption and future potential of its RISC-V technology. SEALSQ’s adoption of RISC-V will materialize with the first engineering samples in late 2024 and certification is expected to be ready for production in Q3 2025.
