DuPont today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI.
Semiconductors
Edgewater Wireless Selected to Join the Alliance of Semiconductor Innovation Canada (ASIC)
Edgewater Wireless Systems Inc. announced that it has joined the Alliance of Semiconductor Innovation Canada (‘ASIC’),an organization dedicated to promoting the Canadian semiconductor ecosystem.
AI-enabled Atomic Robotic Probe to Advance Quantum Material Manufacturing
Scientists from the National University of Singapore (NUS) have pioneered a new methodology of fabricating carbon-based quantum materials at the atomic scale by integrating scanning probe microscopy techniques and deep neural networks.
Renesas Unveils Powerful Single-Chip RZ/V2H MPU for Next-Gen Robotics with Vision AI and Real-Time Control
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has expanded its popular RZ Family of microprocessors (MPUs) with a new device targeting high-performance robotics applications.
FormFactor and Tabor Electronics Collaborate on Full Stack 5-Qubit Quantum Computer
FormFactor, Inc., a semiconductor test and measurement supplier, together with Tabor Electronics LLC, today presented the Echo-5Q project, a demonstration of a full stack 5-Qubit Quantum Computer for research and education, leveraging a QPU supplied by QuantWare.
TANAKA Precious Metals Appoints Bodo Albrecht as President for the Americas
TANAKA Precious Metals announced the appointment of Bodo Albrecht as President of TANAKA Kikinzoku (America).
Shahriar Moinian of Broadcom Wins Si2 Pinnacle Award
Shahriar Moinian, distinguished engineer at Broadcom Corp., has won the quarterly Silicon Integration Initiative Pinnacle Award, recognizing volunteers for their exceptional contributions to Si2’s success as a leading semiconductor research and development joint venture.
Electronics Industry Praises U.S. Government Notice of Funding Opportunity for “Advanced Packaging” Technologies
IPC, the global association for electronics manufacturing, praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
Wise-integration Raises €15 Million in Series B Funding Round to Support International Growth for Its Innovative GaN Solutions
Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for power supplies, today announced financing of €15 million.
Silicon Wafers Market – Growth on the Horizon 2024-2028
Wafer shipments expected to pick up in late 2024.
