AlixLabs, a Swedish semiconductor startup focused on innovative ALE (Atomic Layer Etch) processes, announces that it has been granted 2.5 MSEK (equivalent to approximately 220,000 EUR) by Sweden’s innovation agency Vinnova
Semiconductors
Lattice Semiconductor Appoints Esam Elashmawi Interim Chief Executive Officer
Lattice Semiconductor Corporation, the low power programmable leader, today announced the appointment of Esam Elashmawi, Chief Marketing and Strategy Officer, as Interim Chief Executive Officer effective immediately.
Leti Innovation Days to Highlight Microelectronics Technology Opportunities and the Recent Surge in Global Investing
With the global semiconductor industry gearing up to meet the huge anticipated growth in demand for miniaturized, more resource-efficient electronics for multiple applications, CEA-Leti will present its most recent innovations and breakthroughs to help meet that demand at Leti Innovation Days, June 25-27 in Grenoble.
Navajo Technical University Partners with NSF Center
A partnership that began in 2017 between Navajo Technical University (NTU) and the U.S. National Science Foundation Materials Research Science and Engineering Center at Harvard University is providing Navajo students with new opportunities to pursue advanced degrees in science and engineering while helping to address critical issues facing the Navajo Nation.
Advanced Chip Process Development Grows ALD/CVD Materials
TECHCET is forecasting the Semiconductor Precursor Materials Market to rebound by 15% in 2024, reaching $1.7 billion.
NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries
NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, announced the delivery of the first BE Semiconductor Industries (Besi) next-generation hybrid bonding system to the NHanced advanced packaging facility in Morrisville, NC.
Researchers Create Materials With Unique Combo of Stiffness, Thermal Insulation
Researchers have demonstrated the ability to engineer materials that are both stiff and capable of insulating against heat. This combination of properties is extremely unusual and holds promise for a range of applications, such as the development of new thermal insulation coatings for electronic devices.
Axus Technology Secures $12.5 Million in Capital Funding
Axus Technology, a provider of chemical mechanical planarization (CMP) equipment, critical for manufacturing semiconductors and compound semiconductors, today announced it has received $12.5 million in capital funding from growth capital firm IntrinSiC Investment LLC.
SEMICON Southeast Asia 2024 Opens Today
Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 opens today at MITEC in Kuala Lumpur with visionaries and experts gathered for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development.
New Survey to Access Job Skills Needs in Europe’s Microelectronics Industry
SEMI invites key industry stakeholders to participate in a survey designed to access job skills in highest demand in Europe’s microelectronics industry in 2024.
