PI (Physik Instrumente) offers a series of piezo-flexure controlled nanopositioning stages for high-resolution microscopy and material science applications.
Semiconductors
James Culp of GlobalFoundries Joins Si2 Board
The Silicon Integration Initiative has announced the addition of James Culp, a GlobalFoundries corporate fellow, to its board of directors.
Biden-Harris Administration Announces NY CREATES’ Albany NanoTech Complex as the First CHIPS for America R&D Flagship Facility
Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility.
IBM and Albany Partners Unlock New Yield Benchmarks for EUV Patterning
Working at NY CREATES’s Albany NanoTech Complex, a team of researchers report the newest yields for Low NA and High NA EUV patterning, which shows a pathway to sub-2 nm nodes.
Spin Current Observations From Organic Semiconductor Side
Polymer’s long spin relaxation time helps researchers gain spintronic insights.
ULVAC Launches Technology Center PYEONGTAEK for Next-Gen Semiconductor Manufacturing Equipment in South Korea
ULVAC, Inc. has established Technology Center PYEONGTAEK in Pyeongtaek, Gyeonggi-do, South Korea.
ESCATEC Pushes New Boundaries in Micro-Electronics with UV Enhanced Die Bonder Technology
Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.
DuPont Earns Best Partner Award for Innovation from Samsung Electronics
DuPont today announced it has been selected for the 2024 Best Partner Award from Samsung Electronics in the Innovation category.
Infineon Unveils the World’s Thinnest Silicon Power Wafer
After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, Infineon Technologies AG has unveiled the next milestone in semiconductor manufacturing technology.
Leading University Selects Veeco’s Molecular Beam Epitaxy System
Veeco Instruments Inc. announced today that it has received an order from the Ohio State University for its GENxcel R&D Molecular Beam Epitaxy (MBE) System.
