Semiconductors

UTA Team Exploring New Semiconductor Photonics Technology

A University of Texas at Arlington electrical engineering researcher is maximizing the power of light in the operations of semiconductor chips to make them more efficient, powerful and bright.

NXP Extends Industry-First 28nm RFCMOS Radar One-Chip Family

NXP Semiconductors N.V. today announced an extension of its automotive radar one-chip family.

Using Berry Phase Monopole Engineering for High-Temperature Spintronic Devices

Spintronic devices are electronic devices that utilize the spin of electrons (an intrinsic form of angular momentum possessed by the electron) to achieve high-speed processing and low-cost data storage.

Industry Strategy Symposium 2024 Opens to Highlight Semiconductor Growth Opportunities on Path to $1 Trillion

Semiconductor industry growth opportunities in the year ahead will take center stage at Industry Strategy Symposium (ISS) 2024 as the year’s first executive check-in opens today with leading analysts, researchers, economists, and technologists offering insights on forces impacting the industry.

TI Debuts New Automotive Chips at CES

Texas Instruments today introduced new semiconductors designed to improve automotive safety and intelligence.

National Semiconductor and Advanced Manufacturing Technician Apprenticeship Program Launched to Support State Efforts to Develop Strategic Talent Pipelines

Today the National Institute for Innovation and Technology—the nation’s leader in the semiconductor talent pipeline development and U.S. Department of Labor (USDOL) national Intermediary responsible for establishing and expanding Registered Apprenticeships (RAs) throughout semiconductor and nanotechnology-related industry supply chains—launched the national Semiconductor and Advanced Manufacturing Technician Apprenticeship Program (SAM-TAP).

TDK Ventures Invests in Silicon Box and its Chiplet Technology

TDK Corporation announced today that subsidiary TDK Ventures, Inc. has invested in Singaporean tech disruptor Silicon Box and its innovative semiconductor chiplet packaging design and fabrication capabilities, which offers newfound standards in performance and scale.

MACOM Announces Appointment of Raj Shanmugaraj to its Board of Directors

MACOM Technology Solutions Holdings, Inc., a supplier of semiconductor products, today announced the appointment of Murugesan “Raj” Shanmugaraj as an independent director to MACOM’s Board of Directors, effective January 4, 2024.

Low-Cost Microscope Projection Photolithography System for High-Resolution Fabrication

Scientists from the Leibniz University Hannover have developed a low-cost and user-friendly fabrication technique, called UV-LED-based microscope projection photolithography (MPP), for rapid high-resolution manufacturing of optical elements within seconds.

SIA Applauds Announcement of New CHIPS Incentives

The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced today by the U.S. Department of Commerce and Microchip Technology.

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