Magnachip Semiconductor Corporation celebrated the opening ceremony of Magnachip Technology Company, Ltd. yesterday at its headquarters located in Hefei, China.
Semiconductors
EV Group Highlights Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration at ECTC 2024
Papers to highlight breakthrough capabilities of EVG’s hybrid bonding, LITHOSCALE maskless lithography and IR layer release technology for advanced packaging applications.
Guo Aims at Fundamental Understanding of Emerging Semiconductor Material
NSF provides early career award to support chemist’s research and teaching.
New SEMI University Online Certification Programs to Fast-Track Semiconductor Skills Development
Aiming to help the global semiconductor industry address its talent gap by training and upskilling workers, SEMI today announced that its SEMI University learning platform now offers online course certification programs designed to fast-track semiconductor career development.
Chips Industry May Not Be Fit For Purpose By 2030, Says GlobalData
Next-generation chips represent the next frontier of semiconductor technology, incorporating advancements in design, materials, manufacturing process, performance, and packaging. As computing tasks become more demanding and data-intensive, next-generation chips promise faster speeds and better energy efficiency.
Key Measures of Global Semiconductor Manufacturing Industry Strength Improve in Q1 2024, SEMI Reports
The global semiconductor manufacturing industry in the first quarter of 2024 showed signs of improvement with an uptick in electronic sales, stabilizing inventories and an increase in installed wafer fab capacity, SEMI announced today.
Porotech Selects ClassOne Solstice Single-Wafer Platform
ClassOne Technology and Porotech today announced that Porotech has selected the ClassOne Solstice single-wafer platform for the development and manufacture of GaN products for applications requiring silicon wafer substrates.
NEO Semiconductor Reveals a Performance Boosting Floating Body Cell Mechanism for 3D X-DRAM
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash and DRAM memory, today announced a performance boosting Floating Body Cell Mechanism for 3D X-DRAM.
Polar Semiconductor Announces Plans to Expand Semiconductor Manufacturing Facility in Minnesota
Polar Semiconductor, the only U.S.-based manufacturer specializing in sensor, power, and high-voltage semiconductors, today announced plans to expand its Bloomington, Minnesota manufacturing facility and branch into innovative technologies to serve new customers and markets.
Semiconductor Manufacturing Equipment Market Size is Set to Grow By $46.68B From 2024-2028
The global semiconductor manufacturing equipment market size is estimated to grow by $46.68B from 2024-2028, according to Technavio.
