Sony Semiconductor Israel’s Altair ALT1250 chipset is now certified by Skylo Technologies, ensuring seamless global connectivity across devices.
Semiconductors
EFC Joins the Semiconductor Climate Consortium
EFC Gases & Advanced Materials announced its membership in the Semiconductor Climate Consortium (SCC), managed by SEMI.
SemiLink Materials Secures Growth Capital to Advance U.S. Semiconductor Material Supply Chain Buildout
Carica Sustainable Investments announced today a strategic investment to propel the development of SemiLink Materials, a United States-based semiconductor materials manufacturer and distributor serving the domestic semiconductor manufacturing industry.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
Larg Weiland of PDF Solutions Wins Si2 Pinnacle Award
Larg Weiland, a technical fellow at PDF Solutions, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award, which is presented for exceptional contributions to Si2’s success as a leading semiconductor research and development joint venture.
Semiconductor CMP Pad & Slurry Forecast
CMP consumables for metals to see large growth over next 5 years.
The Flipping Future: Advancements in Flip Chip Packaging
Flip chip technology makes it possible to replace conventional wire interconnections with a direct and strong bond between chips and substrates. The future of silicon packaging is anticipated to be significantly influenced by flip chip technology to satisfy the increasing need for electronics that are faster, smaller, and more efficient.
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
Research published in Nature demonstrates high qubit control fidelity and uniformity in single-electron control.
Purdue-Created Technology Makes 3D Microscopes Easier to Use, Less Expensive to Manufacture
3D microscopes are used in applications from the life sciences to semiconductor manufacturing. Now Purdue engineers are developing patented and patent-pending innovations making them work faster to capture even more 3D images and less expensive to manufacture.
Morse Micro Expands Presence in Taiwan with New Office
Morse Micro today announced the official opening of its new Taiwan branch.
