Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation and Semidynamics, a provider of fully customizable high bandwidth and high-performance RISC-V processor IP, today announced a partnership to accelerate electronic product innovation for artificial intelligence (AI), machine learning (ML) and high-performance computing (HPC) applications.
Semiconductors
Nordic Semiconductor and AmberSemi Announce Partnership
Multi-track partnership to target a range of markets with a breadth of semiconductor application solutions.
SEMI Launches Industry 4.0 Readiness Assessment Model to Advance Semiconductor Smart Manufacturing Maturity
SEMI today announced availability of the new Industry 4.0 Readiness Assessment Model (IRAM) to help organizations across the semiconductor supply chain assess and track their smart manufacturing technology deployment progress and develop a roadmap for their digital transformations.
Semiconductor Supply Chain Problems Running Rampant?
Solutions to mitigate future materials supply vulnerabilities.
Optical-Fiber Based Single-Photon Light Source at Room Temperature for Next-Generation Quantum Processing
Ytterbium-doped optical fibers are expected to pave the way for cost-effective quantum technologies.
Archer Demonstrates Multiplexing Readout for its Advanced Biochip gFET
Archer Materials Limited has demonstrated multiplexing readout for its advanced Biochip graphene field effect transistor (“gFET”) device.
Mary Thornton Joins SIA as Vice President of Global Policy
The Semiconductor Industry Association (SIA) today announced Mary Thornton has joined the association as vice president of global policy.
GOWIN Semiconductor Corporation Expands its Arora V FPGA Family with Advanced Features
GOWIN Semiconductor Corporation, recognized as the world’s fastest-growing FPGA company, is excited to announce an expansion of its Arora V high-performance FPGA family.
UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI
United Microelectronics Corporation, a global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.
Japan Flexes Its Advantages in Semiconductor Upstream Equipment and Raw Materials, and Unveils Strategic Progress of Key Players
In the face of unceasing geopolitical upheavals in recent years, nations worldwide are striving to cultivate homegrown semiconductor supply chains and fortify the stability of their industrial supply dynamics.
