At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
Siliconica
Apple’s M1 Ultra Does Use InFO_LSI – or is it CoWoS-L?
On March 8, Apple held their “Peek Performance” event, introducing the all-new Mac Studio including within it the M1 Ultra processor and its unique (up to now) packaging.
Sony, Samsung, Toshiba, Toppan Have Image Sensor/LiDAR Papers at the VLSI Symposia in June
Since the development of mobile phone camera image sensors, they have been a hot topic with continuous evolution to sub-micron pixels, and more recently the move towards self-driving cars (and other ranging needs) is pushing LiDAR systems.
Samsung Has 18 Talks at the VLSI Symposia in June, Including 3nm GAAFET LDO
The VLSI Symposia are coming up on June 12 – 17, at the Hilton Hawaiian Village in Honolulu, and recently their media associates released the tipsheet describing some of the upcoming papers.
Intel Has 13 Talks at the VLSI Symposia in June, Including Intel 4
The VLSI Symposia are coming up on June 12 – 17, at the Hilton Hawaiian Village in Honolulu, and recently their media associates released the tipsheet describing some of the upcoming papers.
TechInsights Takes Reverse Engineering into the Cloud
At last year’s ISTFA conference, Chris Pawlowicz from TechInsights presented a paper “The Role of Cloud Computing in a Modern Reverse Engineering Workflow at the 5nm Node and Beyond”.
Apple Joins 3D-Fabric Portfolio with M1 Ultra?
On March 8, Apple held their “Peek Performance” event, introducing the all-new Mac Studio and Studio Display, a new iPad Air, the new iPhone SE, and two new shades of green for the iPhone 13 and iPhone 13 Pro.
Pat Gelsinger Takes Us on a Trip Down Memory Lane – and a Look Ahead: Part 2
Having made the transition to FinFET, new generations followed, and we now have the Intel 7 Alder Lake part, released towards the end of last year.
Pat Gelsinger Takes us on a Trip Down Memory Lane – and a Look Ahead: Part 1
Last November, Intel held their Innovation Days, with opening keynote by CEO Pat Gelsinger.
Amazon AWS is Intel Foundry Services First EMIB Packaging Customer?
An interesting confluence of events has occurred in the last few months, starting with the announcement at the Intel Accelerated event in July that Amazon would be one of Intel Foundry Services (IFS) first customers, specifically for packaging.
