Using a plasma-based approach, active oxide removal technology empowers 3D chiplet integration and the HBM devices with fine bump pitch roadmaps and new package architectures.
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Non-Profit Alliances Boost Chips in Canada
Government aid is forthcoming, but new immigration rules restrict talent.
2025: Focus on Integrated Photonics and Chiplets
In the coming year, I expect to see more prototype designs making use of integrated photonics. The demand for better performance is pushing photonic technology toward commercial status and the market is more than ready.
Semi-damascene Metallization: Inflection Point in Back-end-of-line Processing?
When used in combination with a patternable metal such as Ru, semi-damascene promises to be RC, area, cost and power efficient – offering an interconnect scaling path.
Natcast Launches National Semiconductor Technology Center Membership Program
Public-private consortium will focus on innovation, collaboration, and education to bolster the U.S. semiconductor industry…
Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same period.
AI Use Cases in Semiconductor Manufacturing and the Theory of Adjacent Possible
Keynote speaker at SEMI Pac NW event discussed specific AI use case examples in manufacturing before finishing with TAP and a Cambrian explosion.
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ISE Labs Expands Capabilities, Doubles Lab Space with Opening of Second Silicon Valley Location
ISE Labs, Inc., a provider of semiconductor engineering services, today announced it is broadening customer access to its world-class capabilities with the opening of a second U.S. facility, located in San Jose, Calif.
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