Micron Technology, Inc. announced today it will be introducing extreme ultraviolet (EUV) technology to Japan, tapping this sophisticated patterning technology to manufacture its next generation of DRAM, the 1-gamma (1γ) node.
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New Chip Design to Provide Greatest Precision in Memory to Date
A team led by USC, MIT, and the University of Massachusetts, developed a protocol for devices to reduce “noise” and demonstrated the practicality of using this protocol in integrated chips.
2023 Semiconductor Plating for Device and Packaging Expecting Slowdown as Global Economic Conditions Weaken
New technologies such as ruthenium and molybdenum in barrier layers may also replace old plating standards.
Semtech and Exeger Demonstrate Solar Harvesting Technology for Internet of Things (IoT) Sensors
Exeger’s Powerfoyle solar harvesting cell technology combined with Semtech’s LoRa Edge platform enable more efficient and sustainable IoT tracking applications.
China Semiconductor Firms Aggressively Filing Patents as They Expand Operations
To stay ahead, companies must maintain innovation as well as develop and leverage their patent portfolios.
Smart Mobility, Despite Challenges, to Drive Industry’s Growth
Dogged by controversy, smart mobility faces technical, regulatory challenges, experts said at a Smart Mobility panel at 2022 SEMICON West.
Silicon Image Sensor That Computes
Device speeds up, simplifies image processing for autonomous vehicles and other applications.
SEMI MEMS & Imaging Sensors Summit to Highlight Innovation, Industry Growth and Workforce Diversity
More than 400 industry experts will gather for insights into the latest technology developments and trends across the MEMS and sensors supply chain at SEMI MEMS & Imaging Sensors Summit, 6-7 September, 2022 at the World Trade Center (WTC) in Grenoble, France.
