The International Electron Devices Meeting (IEDM) was held in Washington, D.C. this week. I attended a short course on Sunday focused on the Challenges of 10nm and 7nm CMOS Technologies, organized by Aaron Thean of imec. The speakers were Frederic Boeuf of ST Microlelectronics, who gave a general overview of drivers and challenges; Zsolt Tokei of imec, who spoke on interconnect challenges; Andy Wei of GLOBALFOUNDRIES who talked about process…
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MEMS: An Enabler of the Next Internet Revolution
Micro-electromechanical systems (MEMS) and sensor fusion will play a critical role in enabling a more intelligent and intuitive Internet of Things (IoT)—one that will revolutionize the consumer space forever. The MEMS and sensor technology is here today and now is the time to harness it for your products and position yourself for this exciting future. I encourage you to read on and learn about some great examples of MEMS enabling…
Countdown to The ConFab 2014
We had our second conference call yesterday with advisory board of The ConFab (a special thanks to Lori Nye of Brewer Science who called in from Japan at 2:00 am her time. Above and Beyond the call of dutry!). The ConFab will be held June 22-25 at The Encore at The Wynn in fabulous Las Vegas, Nevada. It will be the 10th anniversary of the event and I’m working hard…
IEDM 2013 Preview
Next week, the researchers and practitioners of the electron device world will be gathering in Washington D.C. for the 2013 IEEE International Electron Devices Meeting. To quote the conference web front page, “IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and…
IEDM 2013 Preview
Next week, the researchers and practitioners of the electron device world will be gathering in Washington D.C. for the 2013 IEEE International Electron Devices Meeting. To quote the conference web front page, “IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and…
IEDM 2013 Preview
Next week, the researchers and practitioners of the electron device world will be gathering in Washington D.C. for the 2013 IEEE International Electron Devices Meeting. To quote the conference web front page, “IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and…
Are Hardware Hubs Coming?
Guest Contributor: Bryon Moyer, Editor of EE Journal Sensor fusion has been all the rage over the last year. We’ve all watched as numerous companies – both makers of sensors and the “sensor-agnostic” folks – have sported dueling algorithms. Sensor fusion has broadened into “data fusion,” where other non-sensor data like maps can play a part. This drama increasingly unfolds on microcontrollers serving as “sensor hubs.” But there’s something new…
IEDM’s special focus session highlights diverse challenge
As part of the technical program at the annual IEEE International Electron Devices Meeting (IEDM), scheduled for December 9 – 11, 2013 at the Washington Hilton Hotel, a special focus session has been planned to highlight advanced processing and platforms for semiconductor manufacturing technology, including ‘more-than-Moore’ applications. The technical session, scheduled for Tuesday, December 10 from 9am – 12pm, will feature presentations on many of today’s hot topics: memory, LEDs,…
Progress in Intrachip Optical Interconnects and Silicon Photonics
In a keynote talk at The ConFab earlier this year, Samsung exec Yoon Woo (Y.W.) Lee. predicted that optical interconnects would soon be required. “Exascale computing will require optical interconnection to communicate between the CPU and memory chip,” he said. This appears to be moving closer to reality with last week’s demonstration by Fujitsu and Intel of the world’s first Optical PCIe Express (OPCIe) based server. Intel’s 50Gbps silicon photonics…
GLOBALFOUNDRIES to make Apple chips in New York fab?
I normally don’t have the time to follow local press, but occasionally Google Alerts pops up with something quite interesting. In this case, the Albany Times Union from Albany, New York had an intriguing headline that supports some of the gossip around Apple’s fabrication plans for their A-series processor chips, up to now fabbed by Samsung. At least in the short term, and from a technology point of view, this…
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