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What’s down the road for bulk FinFETs

For the 10nm node and beyond, transistor research efforts are focused on high mobility designs with Ge and III-V channel, reducing VDD supply voltage as well as the subthreshold slope in transistors and optimizing multi-Vt  designs. Eventually, lateral finFETs built from silicon nanowires may be required. As previously reported in the post “Status update on logic and memory roadmaps,” the 14nm node (which imec calls the “N” node”) is in…

EUV is late but on the way for 10nm; DSA is promising

EUV lithography is late, but it is on the way and will be ready for insertion into the 10nm node, which is slated to go into production in late 2015/early 2016. Meanwhile, results from early work into directed self-assembly (DSA) is quite promising. DSA could be used in conjunction with EUV for the 7nm node, scheduled to go into production in the 2017/2018 timeframe. These were some of the conclusions…

Intel stands firm on 450mm; challenged by defects at 14nm

Brian Krzanich, chief executive officer of Intel, said Intel is standing firm on 450mm development (despite rumors to the contrary), during a quarterly conference call with financial analysts. He also blamed defects on a slight push-out of next-generation 14nm technology. When asked about 450mm plans, Krzanich said: “We have not changed our timing. We are still targeting the second, latter half of this decade. We continue to see great value…

Progress on 450mm at G450C

At Semicon Europa last week, Paul Farrar, general manager of G450C, provided an update on the consortium’s progress in demonstrating 450mm process capability. He said 25 tools will be installed in the Albany cleanroom by the end of 2013, progress has been made on notchless wafers with a 1.5mm edge exclusion zone, they have seen significant progress in wafer quality, and automation and wafer carriers are working. G450C is an…

Status update on logic and memory roadmaps

The way in which logic and memory technology is likely to evolve over the next six years was provided at imec’s recent International Technology Forum in Leuven, Belgium. An Steegan, senior vice president process technology at imec, said that FinFETs will likely become the logic technology of choice for the upcoming generations, with high mobility channels coming into play for the 7 and 5nm generation (2017 and 2019). In DRAM,…

Semiconductors that detect cancer

At the recent imec International Technology Forum Press Gathering in Leuven, Belgium, imec CEO Luc Van den hove provided an update on blood cell sorting technology that combines semiconductor technology with microfluidics, imaging and high speed data processing to detect tumorous cancer cells. As I reported previously, the challenge is huge: one has to have the ability to detect one bad tumor cell in 5 billion blood cells. This equate…

Europe’s 10/100/20 program

Despite some economic woes in recent years, Europe remains dedicated to building a strong electronics industry. This was brought home to me recently when, in advance of Semicon Europa (October 7-10 in Dresden), I had a chance to talk with Heinz Kundert, president of SEMI Europe. “There are several initiatives like the KET (key enabling technology) initiative that are working on the same goals to increase the competitiveness but also…

Apple A7 uses Samsung’s 28nm process

Last week, we started tearing down the Apple iPhone 5S. There has been much speculation that Apple would be moving their processor chips over to TSMC, but I think that we can now decisively say that this has not occurred – they have migrated to 28nm, but still at Samsung. Earlier in the day last Friday we established from the look of the die that the A7 was manufactured by…

Apple A7 uses Samsung’s 28nm process

Last week, we started tearing down the Apple iPhone 5S. There has been much speculation that Apple would be moving their processor chips over to TSMC, but I think that we can now decisively say that this has not occurred – they have migrated to 28nm, but still at Samsung. Earlier in the day last Friday we established from the look of the die that the A7 was manufactured by…

Apple A7 uses Samsung’s 28nm process

Last week, we started tearing down the Apple iPhone 5S. There has been much speculation that Apple would be moving their processor chips over to TSMC, but I think that we can now decisively say that this has not occurred – they have migrated to 28nm, but still at Samsung. Earlier in the day last Friday we established from the look of the die that the A7 was manufactured by…

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