I last left you hanging, waiting to hear more about the heated conversations between the panelists and the audience – and I have to tell you, it really started heating up in the audience during the energy panel. Oooh baby, it was jumping. MEMS in energy can mean a lot of things – and our panelists diverse perspectives discussed a great deal, but the majority of the audience wanted to focus…
Uncategorized
Karen’s blog from MEMS Executive Congress: Part 1
There were many things that impressed me from hosting the second MEMS Executive Congress Europe – and it wasn’t the cold and snow (though it was chilly!). What struck me the most was how lively, engaged and intelligent the conversations were, not amongst the panelists but between the audience and the panelists. Often, Europeans can be conservative and reserved in conferences, but not this year In fact my favorite quote…
Join The ConFab discussion
The ConFab is Solid State Technology’s annual conference and networking event. This year, it will be held June 23-26 at The Encore at The Wynn in Las Vegas. We recently started a LinkedIn group, where we will inform members of new activities, and keep the discussion going on topics related to semiconductor manufacturing, design, packaging and testing. Everyone is welcome to join. The overall theme of this year’s conference is…
MEMS Executive Congress Europe 2013 – Amsterdam is THE place to be for the MEMS industry on 12 March!
By Karen Lightman, Managing Director, MEMS Industry Group The keynote address at last year’s MEMS Executive Congress Europe stated: "MEMS is only limited by the imagination." MEMS Industry Group (MIG) took that sentiment to heart, and organized a 2013 EU Congress chock full of interesting keynotes, panels, dialogue, and camaraderie. We invited some of the top European companies using and commercializing MEMS to share their insight and imagination on the…
Intel Foundries MEMS for Fuel Cell Start-up Nectar
In the last couple of years there have been announcements that Intel will be acting as a foundry for FPGA company Achronix, PLD maker Tabula and programmable network processor provider Netronome, as well as much speculation about making chips for Apple. All these reports refer to using Intel’s leading-edge 22-nm tri-gate process. However, at CES a couple of weeks ago, my eye was caught by a 200-mm wafer on display…
Intel Foundries MEMS for Fuel Cell Start-up Nectar
In the last couple of years there have been announcements that Intel will be acting as a foundry for FPGA company Achronix, PLD maker Tabula and programmable network processor provider Netronome, as well as much speculation about making chips for Apple. All these reports refer to using Intel’s leading-edge 22-nm tri-gate process. However, at CES a couple of weeks ago, my eye was caught by a 200-mm wafer on display…
Intel Foundries MEMS for Fuel Cell Start-up Nectar
In the last couple of years there have been announcements that Intel will be acting as a foundry for FPGA company Achronix, PLD maker Tabula and programmable network processor provider Netronome, as well as much speculation about making chips for Apple. All these reports refer to using Intel’s leading-edge 22-nm tri-gate process. However, at CES a couple of weeks ago, my eye was caught by a 200-mm wafer on display…
Questions and answers on FD-SOI
A month or so ago, we implemented (without much fanfare) the ability to comment and rank articles on this site, and more easily use social media tools. I’d like to call your attention to one interesting exchange, and also invite you to start posting comments of your own. In mid-December, we posted an article titled “STMicro: 28nm FD-SOI is ready for manufacturing” which elicited an interesting comment and response. The…
MEMS is happening in Vegas baby, and it’s coming home with you, too
By Karen Lightman, managing director, MEMS Industry Group Everyone knows the famous refrain, "What happens in Vegas, stays in Vegas." But for MEMS, you’ll want what happens in Vegas to come home with you. Why? Because MEMS at CES has gone waaaaay beyond sensing your touch and letting you play Angry Birds. MEMS Industry Group (MIG) is going back for a second year to International CES — because MEMS is…
IBM surprises with 22nm details at IEDM
Monday afternoon at the 2012 IEEE International Electron Devices Meeting, IBM discussed their 22nm SOI high-performance technology [1], aimed at servers and high-end SoC products. To an extent, this is an extension of the 32nm process, using epitaxial SiGe for the PMOS channels and stress, and dual-stress liners for both NMOS and PMOS strain. However, there were a couple of surprises buried in there — at least for me! The…