At the tail end of last year Sony released their PlayStation Vita, and it was duly torn down by iFixit and others. In due course we took it apart too, though we didn’t post it on our teardown blog. Sony CXD5315GG in the PlaySation Vita Inside we found the usual set of wireless chips, motion sensors, and memory, but the key to the increased performance of the PS Vita is…
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Sony’s PS Vita Uses Chip-on-Chip SiP – 3D, but not 3D
At the tail end of last year Sony released their PlayStation Vita, and it was duly torn down by iFixit and others. In due course we took it apart too, though we didn’t post it on our teardown blog. Sony CXD5315GG in the PlaySation Vita Inside we found the usual set of wireless chips, motion sensors, and memory, but the key to the increased performance of the PS Vita is…
The ConFab: Big data is here
Sponsors and delegates arrived today in sunny Las Vegas, for the 8th annual "The ConFab," our conference and networking event that features planned meetings between conference sessions. Everything is set up and we’re ready to go, comfortably ensconced in The Encore at The Wynn. The conference and meals will be in the Bach and Beethoven rooms on the second floor (very nice!) and we have a networking reception event tonight…
Oh, snap!: Pics from The ConFab
Some pics from The ConFab 2012 setup: Getting the conference books ready to distribute (Luba and Karen), inside the book, various signs — sessions, sponsors, Solid State Technology — view down the hall, Sabrina at the conference table, The ConFab map.
Funding the future: How best to spend limited R&D dollars?
One of the big issues now facing the industry is to how best spend limited funding for research and development, when so much needs to be done. Continued scaling to 20nm and below, a transition to 450mm, 3D integration, device new structures, a bevy of new materials with unknown integration challenges – these are all needed. These issues are top of mind since I’ve been asked to moderate a panel on…
Thirty years ago today
Today marks an interesting milestone for me: 30 years ago, I started work as an editor covering the semiconductor industry. I reported to Don Levinthal, publisher of Semiconductor International, at 222 W. Adams in downtown Chicago. The magazine was produced by Cahners, which had recently acquired Kiver Publications. Milt Kiver, as I recall, had won fame and fortune by writing a book on color television repair (Television Simplified, first published…
Intel’s 22-nm Trigate Transistors Exposed
Last week Intel had their Q1 conference call for financial analysts, and revealed that the 22-nm Ivy Bridge parts would make up 25% of their shipment volume in the second quarter of this year. That means that a good quantity will already will have shipped, and we managed to track some down in Hong Kong a few weeks ago. Of course we got in touch ASAP and the parts duly…
Intel’s 22-nm Trigate Transistors Exposed
Last week Intel had their Q1 conference call for financial analysts, and revealed that the 22-nm Ivy Bridge parts would make up 25% of their shipment volume in the second quarter of this year. That means that a good quantity will already will have shipped, and we managed to track some down in Hong Kong a few weeks ago. Of course we got in touch ASAP and the parts duly…
Intel’s 22-nm Trigate Transistors Exposed
Last week Intel had their Q1 conference call for financial analysts, and revealed that the 22-nm Ivy Bridge parts would make up 25% of their shipment volume in the second quarter of this year. That means that a good quantity will already will have shipped, and we managed to track some down in Hong Kong a few weeks ago. Of course we got in touch ASAP and the parts duly…
The packaging side of The ConFab
The ConFab has gained a reputation as the place to meet to discuss front-end semiconductor manufacturing issues – and that’s true today more than ever – but there has also been a strong focus on the packaging side of the equation. The ConFab has highlighted specific packaging technologies that will be need now and in the future, beyond the natural tie-in that packaging has with any discussion of trends in…
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