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Funding the future: How best to spend limited R&D dollars?

One of the big issues now facing the industry is to how best spend limited funding for research and development, when so much needs to be done. Continued scaling to 20nm and below, a transition to 450mm, 3D integration, device new structures, a bevy of new materials with unknown integration challenges – these are all needed. These issues are top of mind since I’ve been asked to moderate a panel on…

Thirty years ago today

Today marks an interesting milestone for me: 30 years ago, I started work as an editor covering the semiconductor industry. I reported to Don Levinthal, publisher of Semiconductor International, at 222 W. Adams in downtown Chicago. The magazine was produced by Cahners, which had recently acquired Kiver Publications. Milt Kiver, as I recall, had won fame and fortune by writing a book on color television repair (Television Simplified, first published…

Intel’s 22-nm Trigate Transistors Exposed

Last week Intel had their Q1 conference call for financial analysts, and revealed that the 22-nm Ivy Bridge parts would make up 25% of their shipment volume in the second quarter of this year.  That means that a good quantity will already will have shipped, and we managed to track some down in Hong Kong a few weeks ago.  Of course we got in touch ASAP and the parts duly…

Intel’s 22-nm Trigate Transistors Exposed

Last week Intel had their Q1 conference call for financial analysts, and revealed that the 22-nm Ivy Bridge parts would make up 25% of their shipment volume in the second quarter of this year.  That means that a good quantity will already will have shipped, and we managed to track some down in Hong Kong a few weeks ago.  Of course we got in touch ASAP and the parts duly…

Intel’s 22-nm Trigate Transistors Exposed

Last week Intel had their Q1 conference call for financial analysts, and revealed that the 22-nm Ivy Bridge parts would make up 25% of their shipment volume in the second quarter of this year.  That means that a good quantity will already will have shipped, and we managed to track some down in Hong Kong a few weeks ago.  Of course we got in touch ASAP and the parts duly…

The packaging side of The ConFab

The ConFab has gained a reputation as the place to meet to discuss front-end semiconductor manufacturing issues – and that’s true today more than ever – but there has also been a strong focus on the packaging side of the equation. The ConFab has highlighted specific packaging technologies that will be need now and in the future, beyond the natural tie-in that packaging has with any discussion of trends in…

Intel to Present on 22-nm Tri-gate Technology at VLSI Symposium

Just published is the press release and tip-sheet on the 2012 VLSI Symposia on VLSI Technology and Circuits, this year in Hawaii. Listed first in the VLSI Technology highlight papers is Intel’s paper, “A 22nm High-Performance and Low-Power CMOS Technology Featuring Fully Depleted Tri-Gate Transistors, Self-Aligned Contacts and High-Density MIM Capacitors”, to be presented by Chris Auth in slot T15-2. There was a fair bit of frustration at last year’s…

Intel to Present on 22-nm Tri-gate Technology at VLSI Symposium

Just published is the press release and tip-sheet on the 2012 VLSI Symposia on VLSI Technology and Circuits, this year in Hawaii. Listed first in the VLSI Technology highlight papers is Intel’s paper, “A 22nm High-Performance and Low-Power CMOS Technology Featuring Fully Depleted Tri-Gate Transistors, Self-Aligned Contacts and High-Density MIM Capacitors”, to be presented by Chris Auth in slot T15-2. There was a fair bit of frustration at last year’s…

Intel to Present on 22-nm Tri-gate Technology at VLSI Symposium

Just published is the press release and tip-sheet on the 2012 VLSI Symposia on VLSI Technology and Circuits, this year in Hawaii. Listed first in the VLSI Technology highlight papers is Intel’s paper, “A 22nm High-Performance and Low-Power CMOS Technology Featuring Fully Depleted Tri-Gate Transistors, Self-Aligned Contacts and High-Density MIM Capacitors”, to be presented by Chris Auth in slot T15-2. There was a fair bit of frustration at last year’s…

Dialog Semi Gets the Girls for Apple

Over the years we have looked at a number of products from Apple, and in their mobile products we have seen a continuous series of design wins for power management chips from Dialog Semiconductor, all custom-made parts since they have not been in their normal product listings.  One of the distinguishing features of each part has been the code names Dialog has used for them – as my colleague Jim…

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