IBM likes to create a stir once in awhile, and judging by the tech-press response in the last week or three, they have achieved that goal with their announcement of 2-nanometer CMOS technology, developed at their Albany research centre. This technology is expected to give a 45% performance boost or 75% power reduction, compared with a 7-nm process. Of course the question is, compared with what 7-nm process?
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Honoring Bill Tobey
I have some sad news to share. Industry pioneer and legend Aubrey “Bill” Tobey passed away on March 1st. He was a good friend and a great supporter of The ConFab event that we produced.
Merck KGaA, Darmstadt, Germany Moves the Silicon Valley Innovation Hub to San Jose’s Intermolecular Site
Merck KGaA, Darmstadt, Germany, a leading science and technology company, has moved its Silicon Valley Innovation Hub team to San Jose’s Intermolecular’s 150,000 sqft facility, creating a unique space for innovation and collaboration at the intersection of life science, healthcare and electronic materials.
BrainChip’s Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI
BrainChip Holdings Ltd. ended the 2020 calendar year having made significant strides in the development of its technology backed by the launch of its Early Access Program (EAP), availability of Akida evaluation boards, new partnerships, and expansion of its executive leadership and global facilities.
Semtech to Enable 50Gbps PAM4 Front Haul 5G Wireless Deployment with Industry’s First 5G Front Haul Tri-Edge CDR IC Solution
Semtech Corporation (Nasdaq: SMTC), a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, today announced sampling of a new solution (GN2255), Semtech’s Tri-Edge CDR to enable emerging 50Gbps PAM4 5G front haul deployments.
IAR Systems Announces Availability of RISC-V Development Tools with Certification for IEC 61508 and ISO 26262
IAR Systems, the future-proof supplier of software tools and services for embedded development, announces the availability of a certified edition of its development toolchain for RISC-V.
proteanTecs Joins the TSMC IP Alliance Program
proteanTecs, a leading provider of health and performance monitoring solutions for advanced electronics, today announced it has joined the TSMC IP Alliance Program, a key component of TSMC’s Open Innovation Platform (OIP).
Thermo Scientific Spectra Ultra Offers a Leap Forward for Advanced Materials Characterization
Thermo Fisher Scientific, the world leader in serving science, today unveiled the Thermo Scientific Spectra Ultra, a next-generation scanning transmission electron microscope ((S)TEM) that offers structural and chemical insight on a wide range of materials at atomic-scale resolution.
CEA-Leti Announces 16 Papers to be Presented at Photonics West 2021 and a Virtual Workshop on March 25
CEA-Leti, a technology research institute of CEA Tech, will present 16 papers during Photonics West 2021, March 6-11, including an invited paper, “Advanced roughness characterization for 300mm Si photonics patterning & optimization”.
CEA-Leti & Dolphin Design Report FD-SOI Breakthrough
CEA-Leti and Dolphin Design have developed an adaptive back-biasing (ABB) architecture for FD-SOI chips that can be seamlessly integrated in the digital design flow with industrial-grade qualification, overcoming integration drawbacks of existing ABB techniques. Fully Depleted Silicon on Insulator (FD-SOI) is a technology that allows the biasing of the transistor’s body that acts as a back gate. Unlike conventional bulk technology, FD-SOI enables a wide voltage range of the body…
