The detection of cracks after the wafer is diced into individual die has become critical in high reliability applications, like the automotive market, where there are substantial safety and liability concerns.
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Building Stronger, Better Designs with DTCO CMP Modeling and Simulation
Predicting CMP damage has always been a part of the manufacturing process, but in a Design-technology co-optimization (DTCO) flow, foundries and EDA companies can work together to automate CMP model building and simulation.
Light and Sound In Silicon Chips: The Slower The Better
Integrated circuits in silicon enable our digital era. The capabilities of electronic circuits have been extended even further with the introduction of photonics: components for the generation, guiding and detection of light. Together, electronics and photonics support entire systems for data communication and processing, all on a chip. However, there are certain things that even electrical and optical signals can’t do simply because they move too fast.
Process Watch: A Statistical Approach to Improving Chip Reliability
The Process Watch series explores key concepts about process control—defect inspection, metrology and data analytics—for the semiconductor industry. This article is the fifth in a series on process control strategies for automotive semiconductor devices.
Wafer Backgrinding Tape Market to Reach $261.42 Mn, Globally, by 2026 at 4.9% CAGR
Rise in demand for ultra-thin wafers, increase in need for wafer fabrication, surge in in focus toward wafer surface protection during grinding process, and high-end development in the semiconductor industry propel the growth of the global wafer backgrinding tape market.
Kalray Announces the Tape-out of Coolidge on TSMC 16nm Process Technology
Kalray (Euronext Growth Paris: ALKAL), pioneer in processors for new intelligent systems, today announced the tape-out of MPPA3 aka Coolidge, its third generation of unique and patented MPPA® («Massively Parallel Processor Array») processor family, on TSMC 16nm FinFET process technology. The tape-out is an important milestone for a semiconductor company, as it indicates the completion of the design phase and the beginning of the manufacturing process. As new generation of…
Introducing Semiconductor Digest
I’m delighted to introduce Semiconductor Digest, a new business-to-business publication focused on the dynamic semiconductor manufacturing industry. Check out this link to our new Media Kit. If you’re interested in contributing content, please let me know. Our inaugural issue will be in June 2019, and we’ll have July show copies at Semicon West. I’ll be using my 37 years of publishing experience – 25+ years at Semiconductor International and 11+…
Intel announces broadest product portfolio for moving, storing and processing data
Customers turn to Intel for processor performance, advanced AI optimization and breakthrough persistent memory capabilities Intel unveiled a new portfolio of data-centric solutions consisting of 2nd-Generation Intel Xeon Scalable processors, Intel Optane DC memory and storage solutions, and software and platform technologies optimized to help its customers extract more value from their data. Intel’s latest data center solutions target a wide range of use cases within cloud computing, network infrastructure…
Metal nanoclusters can be used as semiconductors: Key properties observed for first time
Tiny nanoclusters of metal atoms – such as gold and silver – have properties which mean they can be used as semiconductors, a joint Swansea-Hamburg research team has discovered. The finding opens the door to a wide range of potential new applications, from phone displays and flatter screens to wearable technology. Semiconductors are at the heart of modern electronics. Amongst their many uses are in display devices for mobile phones…
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