The Chips Joint Undertaking announced a strategic collaboration with the European Union and the Republic of Korea to advance semiconductor research, development, and innovation. This partnership aims to foster technological advancements, enhance supply chain resilience, and secure a leading position in the global semiconductor industry.
In a groundbreaking decision, the EU and the ROK have selected four jointly funded projects that focus on heterogeneous integration and neuromorphic computing technologies. These projects are designed to leverage the strengths of both regions, fostering collaboration between research institutions and innovation players. Highlighting the significance of this partnership, Thierry Breton, Commissioner for the Internal Market, remarked “Today, together with the Republic of Korea, we jointly embark on four new projects that will shape the future of semiconductor technology. These initiatives, which synergise European and Korean expertise, exemplify our shared commitment to pioneering advancements in AI and semiconductors. This is an important deliverable of the EU-Republic of Korea Digital Partnership, following the second ministerial meeting we hosted in Brussels on 26 March 2024. This collaboration is a testament to our enduring partnership and mutual pursuit of excellence in cutting-edge research and innovation.”
Lee Jong-Ho, Korean Minister for Science and ICT, stated, “With this ROK-EU semiconductor joint research, we will establish a cooperative network with excellent semiconductor researchers from various EU countries to secure the super gap advantage in semiconductor technologies.” And he explained, “We expect to secure cutting-edge heterogeneous integration and neuromorphic technologies necessary for next-generation AI semiconductors and autonomous driving applications in the four ROK-EU consortium projects jointly selected this year.”
The selected projects, which are co-funded by the Chips JU under Horizon Europe and the National Research Foundation of Korea (NRF), include:
- ENERGIZE – Developing brain-like circuits using two-dimensional materials to create energy-efficient AI systems.
- NEHIL – Creating a laser-based radar system (LIDAR) that integrates various technologies for precise distance measurement.
- HAETAE – Developing photonic brain-like chips that efficiently process AI tasks and can adapt to new functions.
- ViTFOX – Enhancing visual data processing AI by using ferroelectric materials to save power and improve performance.
These initiatives reflect the EU and Korea’s commitment to advancing next-generation AI semiconductors and autonomous driving technologies. The total investment for these projects is approximately €6 million from the EU and a similar amount from the NRF over the next three years.
The collaboration builds on the strong diplomatic and economic ties between the EU and Republic of Korea, established over six decades. The EU-ROK Free Trade Agreement (2011) and the Agreement on the Scientific and Technological Cooperation (2006) have laid the groundwork for this partnership. Recent initiatives, such as the EU-ROK Digital Partnership announced in November 2022 and the first Digital Partnership Council held in June 2023, have further solidified this relationship.
The Chips JU, along with the NRF and European Commission, will closely monitor the progress of these projects and seek additional opportunities for collaboration. This partnership not only aims to advance semiconductor technology but also to establish a robust network of cooperation among leading researchers and institutions from both regions.
