Chip-Scale Packages (CSP) continue to be in strong demand for IC needing the smallest form-factors for applications including automotive, industrial applications to mobile phones and wearable electronics, according to leading market research firm TechSearch International. TechSearch’s latest CSP market forecast shows a 8% CAGR from 2015 to 2020, despite a slowing growth rate for smartphones.
One of the categories with the strongest growth is the quad flat no-lead (QFN) package with a CAGR of 8.6%. QFNs are a low-cost, low-profile package found in a wide range of products from automotive and power devices. An analysis of the Out-Sourced Assembly and Test (OSAT) market in China provides insight into expansion plans and market shares.
Fan-Out Wafer-Level Packages (FO-WLP) with many variations are now winning slots in many new mobile devices. New advanced packages such as JCAP’s FO-WLP are highlighted in the latest Advanced Packaging Update, along with the use of TSMC’s FO-WLP for Apple’s A10 application processor. The report also examines trends in stacked die CSPs, laminate-substrate CSPs, and package-on-package (PoP) with a market forecast for each. See: http//www.techsearchinc.com.
—E.K.