Panel Discussion: New Updates in Optimizing Automotive Electronics Reliability

Originally held on September 14, 2023
Now available for On Demand viewing

Overview:

Distributed architectures, AI, wideband gap materials, chiplets and higher frequency devices are just some of the new technologies driving a new era of innovation and collaboration between car makers and chip makers. Join us for an on-line panel discussion focused on how this is impacting the mission profiles of automotive semiconductors, and what it means to defectivity control and reliability across the supply chain.

Key discussion points/What you’ll learn:

• Learn about the changing nature of automotive electronics as car makers move to software-defined vehicles, increased autonomous/assisted driving and electrification while still meeting strict needs for safety and reliability.
• Find out why electrification is driving a push to wideband gap materials, notably SiC and GaN, and higher frequency devices.
• Electronics architectures inside the vehicle are shifting to distributed computing: ECUs, zone controllers and sensors & actuators (edge devices). The panel will discuss how this impacts semiconductor requirements, including CPUs, GPUs, SoC, ASICs and chiplets.
• Most electronics have “mission profiles” and those profiles may change over the lifetime of the devices. Find out why there’s interest in standardization of mission profiles, and potential challenges and barriers.
• Learn about new degrees of innovation and collaboration between auto makers, chip makers and equipment and materials suppliers.

Panelists:

Friedrich Schroeder, Robert Bosch GmbH, Reutlingen, Germany

Friedrich Schroeder is a senior expert at Robert Bosch GmbH Automotive Electronics division. He studied electrical engineering at the University of Hannover and subsequently joined IBM in 2005 where he has worked on circuit design for server class microprocessors. He joined Bosch in 2018 where he works in Automotive quality and supplier management. His fields of interest are Robustness Validation and Design for Reliability.

 

Matt Marudachalam, Reliability Engineering Manager, Texas Instruments, Inc.

Matt Marudachalam, with over 24 years of experience in the semiconductor manufacturing sector, is the Worldwide Quality and Reliability Engineering Manager for Texas Instruments, Inc. He holds a doctoral degree in Materials Science from the University of Delaware. Matt’s experience includes wafer fab process and process integration engineering and fab, assembly, and product reliability engineering. The team he currently leads provides reliability and qualification strategies and support for products across TI.

 

Andreas Aal, Chair EU-Chapter SEMI GAAC, Volkswagen Group, Wolfsburg, Lower Saxony, Germany

Andreas Aal, with over 24 years of experience in the field of semiconductor and system reliability drove the semiconductor strategy & reliability assurance activities within the electric-/electronic development department at Volkswagen, Germany, for many years. He is chair of the German VDE ITG group MN 5.6 on (f)WLR, reliability simulations and qualification and chair of the European chapter of the SEMI Global Automotive Advisory Council (GAAC). He was awarded with the electronic design automation achievement award 2020 from the German Federal Ministry of Education and Research for this work on the development of the methodology and infrastructure to improve collaboration within the automotive value chain.

 

Wenge Yang, Ph.D., Vice President, Market Strategy, Entegris

Dr. Yang joined Entegris in 2012 to serve as the Vice President of Market Strategy. In his role, he is responsible for Entegris product and market strategy, market research and market trend analysis, strategic marketing, and the company’s strategic technology roadmap. Prior to joining Entegris, Dr. Yang was an equity research analyst at Citigroup covering the semiconductor equipment and materials sector. He also served in various executive roles at Advanced Micro Devices, Tokyo Electron and two start-up companies. Dr. Yang received a Ph.D. in Materials Science and Engineering and a MBA from Rensselaer Polytechnic Institute.