Panel Discussion on Automotive Electronics Reliability

Originally held on March 30, 2022
Now available for On Demand viewing

Overview:

The fast change of the in-vehicle electronics architecture from distributed ECU networks towards vehicle cloud computing is a consequence of immediate functional and security needs. Join us for an on-line panel discussion focused on how these changes are impacting the “mission profiles” of automotive semiconductors, how semiconductor manufacturers changing their operations to adapt to these changes, and how can the automotive industry and semiconductor manufacturers are working jointly on quality assurance and creating frameworks that improve functional safety from the beginning of the process (design) to the end of the process (the useful life of the automobile).

 

Panelists:

 

Friedrich Schroeder, Robert Bosch GmbH, Reutlingen, Germany

Friedrich Schroeder is a senior expert at Robert Bosch GmbH Automotive Electronics division. He studied electrical engineering at the University of Hannover and subsequently joined IBM in 2005 where he has worked on circuit design for server class microprocessors. He joined Bosch in 2018 where he works in Automotive quality and supplier management. His fields of interest are Robustness Validation and Design for Reliability.

 

Jay Rathert, Sr. Director Strategic Collaborations, KLA

Jay Rathert is a senior director and 25-year employee of KLA Corporation, where he has held a variety of technical, sales and marketing roles. He currently leads KLA’s collaborative efforts with global automotive partners, fabless design houses and semiconductor test and EDA companies. Jay holds several patents regarding semiconductor manufacturing reliability methods. Prior to KLA, he served as a Topgun fighter pilot in the U.S. Navy and is a graduate of Duke University.

 

Matt Marudachalam, Reliability Engineering Manager, Texas Instruments, Inc.

Matt Marudachalam, with over 24 years of experience in the semiconductor manufacturing sector, is the Worldwide Quality and Reliability Engineering Manager for Texas Instruments, Inc. He holds a doctoral degree in Materials Science from the University of Delaware. Matt’s experience includes wafer fab process and process integration engineering and fab, assembly, and product reliability engineering. The team he currently leads provides reliability and qualification strategies and support for products across TI.

 

Andreas Aal, Chair EU-Chapter SEMI GAAC, Volkswagen Group, Wolfsburg, Lower Saxony, Germany

Andreas Aal, with over 24 years of experience in the field of semiconductor and system reliability drove the semiconductor strategy & reliability assurance activities within the electric-/electronic development department at Volkswagen, Germany, for many years. He is chair of the German VDE ITG group MN 5.6 on (f)WLR, reliability simulations and qualification and chair of the European chapter of the SEMI Global Automotive Advisory Council (GAAC). He was awarded with the electronic design automation achievement award 2020 from the German Federal Ministry of Education and Research for this work on the development of the methodology and infrastructure to improve collaboration within the automotive value chain.

 

Wenge Yang, Ph.D., Vice President, Market Strategy, Entegris

Dr. Yang joined Entegris in 2012 to serve as the Vice President of Market Strategy. In his role, he is responsible for Entegris product and market strategy, market research and market trend analysis, strategic marketing, and the company’s strategic technology roadmap. Prior to joining Entegris, Dr. Yang was an equity research analyst at Citigroup covering the semiconductor equipment and materials sector. He also served in various executive roles at Advanced Micro Devices, Tokyo Electron and two start-up companies. Dr. Yang received a Ph.D. in Materials Science and Engineering and a MBA from Rensselaer Polytechnic Institute.

 

Dr. Islam Salama, CEO, Hyperion Technologies