TECHCET— the electronic materials advisory firm providing semiconductor materials supply chain & market information — is expecting the global semiconductor packaging materials market to enter a growth phase in 2024 with a 5.6% compound annual growth rate (CAGR) through 2028. This increase, announced by TECHCET in partnership with SEMI and TechSearch International in the updated Global Semiconductor Packaging Materials Outlook (GSPMO) report, is driven by strong overall semiconductor demand for various end applications. Additionally, AI is forecasted to propel growth for advanced packaging applications.
“After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024,” said Lita Shon-Roy, TECHCET President and CEO. “The global packaging materials market is expected to exceed $26 billion by 2025 and continue solid growth through 2028.”
The GSPMO Report features 8 chapters with forecasts, technology trends, market sizes, and more for the following: substrates, leadframes, bonding wire, encapsulation materials, underfill materials, die attach materials, wafer level package dielectrics, and wafer level plating chemicals. Buy the whole report at https://www.semi.org/en/products-services/market-data/packaging-materials-outlook or choose to purchase Individual chapters through TECHCET at: https://techcet.com/product/packaging-materials/