How Dynamic Force Measurement is Driving the Global Semiconductor Ecosystem Ahead

Originally held on October 20, 2022
Now available for On Demand viewing

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Overview:

Piezoelectric force measurement solutions are driving the global semiconductor ecosystem ahead. Join Jim Macy and Robert Hillinger at our webinar to learn how this technology can optimize both frontend and backend chip fabrication processes. After an introduction to Kistler and its role in the development of sensing crystals and piezoelectric technology, the two experts explain the piezoelectric effect and how it is used to detect mechanical stress in semicon production. They go on to discuss specific aspects of integrated force monitoring and control for chip fabricators, such as:

  • Improving press force accuracy: chemical-mechanical planarization (CMP)
  • Die tension control to optimize the wafer lamination process
  • Die sorting: direct direction of die cracking stress and determination of peeling energy
  • Thermocompression bonding: control of parameters such as temperature, force and Z-axis travel

Based on the example of spring-loaded test probe production, you will see how force-displacement monitoring determines the spring constant in order to verify functionality, ensuring that only precise and reproducible probes are delivered – with full traceability. A Q&A session rounds off the webinar – your chance to question the experts.

What you’ll learn:

  • Key facts about Kistler: how the global leader’s measurement technology is helping the global semiconductor ecosystem to advance
  • The piezoelectric effect: what it is, and how it is utilized to measure forces
  • Benefits of detecting mechanical stress in semicon production
  • Integrated force monitoring and control as the key to optimizing both frontend and backend chip fabrication processes:
      • Improving press force accuracy: chemical-mechanical planarization (CMP)
      • Die tension control to optimize the wafer lamination process
      • Die sorting: direct detection of die cracking stress and determination of peeling energy
      • Thermocompression bonding: control of parameters such as temperature, force and Z-axis travel
  • Functionality and traceability: how force-displacement monitoring determines the spring constant to verify the functionality of each test probe produced on a real machine
  • How XY monitoring ensures transparency and compliance with tolerances – while avoiding potential recall costs because bad parts are reliably separated
  • Get answers to your own questions in the Q&A that rounds off the webinar

Presented by:

Jim Macy
Application Expert BU Advanced Manufacturing
Kistler Group

About the Presenter:

In his role as Application Expert BU Advanced Manufacturing with the Kistler Group, Jim is a seasoned sales professional specializing in high-technology solutions and partnership development. He joined Kistler immediately after gaining his mechanical engineering degree from The State University of New York at Buffalo in 1985, and has remained with the global measurement technology leader ever since. Positions he has held during his 37-year career include Applications Engineer, Regional Manager, Account Development and Senior Manufacturing Specialist. Based at Kistler’s facility in Novi, Michigan, Jim now draws on his vast experience of innovative dynamic measurement technology to help drive the global semiconductor ecosystem ahead.

Robert Hillinger
Business Development Manager – Advanced Manufacturing
Kistler Group

About the Presenter:

Based at Kistler’s headquarters in Winterthur, Switzerland, Robert is an acknowledged expert on the use of piezoelectric sensors to measure dynamic force in semiconductor applications. He graduated in electrical engineering from the Mödling Higher Technical Institute (Austria) in 1989 and subsequently gained an Executive MBA from the Kalaidos University of Applied Sciences in Zurich (Switzerland). During his career in the industrial automation sector, he held positions ranging from Global Product Manager Industrial Automation to Team Leader Commercial Engineering (Germany, Austria and Switzerland) before he joined Kistler Instrumente AG in 2018. Robert now focuses on helping semiconductor manufacturers to benefit from the advantages of piezoelectric force sensor solutions from the global measurement technology leader.

Moderated by:

Pete Singer
Editor-in-Chief
Semiconductor Digest

Sponsored by:

Kistler_Logo_CMYK

The Kistler Group is the global market leader in dynamic measurement technology. Founded in 1959 following the groundbreaking invention of the charge amplifier by Walter P. Kistler and Hans Conrad Sonderegger, Kistler’s continuous growth has seen it evolve from a mere component manufacturer into a development partner for industry and scientific research. Some 2,000 employees at more than 60 facilities around the world develop new solutions in fields as diverse as space travel, competitive sports, vehicle safety and semiconductor manufacturing, backed by a full range of application-specific services at the local level. The company’s claim – measure. analyze. innovate. – captures the Kistler approach in three words: to measure means to understand; to understand means to change – the basis for innovation that drives success. In 2021, the Kistler Group posted sales of mCHF 411; about 7% of this figure is reinvested in research and technology – with the aim of delivering better results for every customer.