TECHCET expects 2025 metal plating chemicals to rise to US$1,060 M in 2025, growing 9% over 2024. The largest segment is Cu plating chemicals used for device level interconnect, and SnAg/Sn for package level interconnects. This growth is anticipated to persist over the coming years with “an 8% CAGR through 2028 in advanced packaging materials, and 4.5% for Cu for device interconnect materials,” remarked TECHCET’s CEO, Lita Shon-Roy.
Future growth is majorly driven by high demand for all chips, logic, NAND, and DRAM. Additional drivers for metal chemicals include increased use of advanced packaging, redistribution layers, and copper pillar structures. Increased interconnect layers in next-generation advanced logic devices, alongside increased buried power rails and backside Cu wiring, are also expected to drive growth.
Heterogenous integration, EMIB, Chiplets, and power devices will challenge plating requirements in terms of the quality of material being deposited. These new plating requirements for advanced packaging will continue to drive innovation to meet requirements for hybrid bonding. Increasing adoption of RDL based packaging across multiple segments will drive new demand for plating chemicals.