Nordson Electronics Solutions Introduces New Helios System

Nordson Electronics Solutions introduces a system-solution for dispensing single-component (1K) thermalinterface materials by integrating the ASYMTEK Helios SD-960 Series fluid dispensing platform with the new FS-EP1 Fluid Supply/Feeding System One-Gallon Pail Pump.

Nordson Electronics Solutions introduces a system-solution for dispensing single-component (1K) thermalinterface materials by integrating the ASYMTEK Helios SD-960 Series fluid dispensing platform with the new FS-EP1 Fluid Supply/Feeding System One-Gallon Pail Pump.

Single-component thermal interface materials (TIMs), often used as gap fillers in electronics manufacturing, are highly viscous and abrasive, making them difficult to feed from the original packaging to the dispense valve. Facility air pressure and chunk pumps are commonly used to transfer these thick materials. However, these are not long-term solutions because the air pressure is often insufficient or the pump wears out faster, leading to premature failure. The new FS-EP1 pail pump pushes material to the dispense valve using a closed-hydraulic system. Low shearing of the material ensures that highly conductive thermal gap fillers do not separate, and material properties remain unaffected. There are no moving parts in contact with the gap filler, and no moving parts outside the pump enclosure, not even in the fluid line.

Equipment details:

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