Nordson MARCH, a division of Nordson (NASDAQ:NDSN) will present the paper, “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong 11-15 August 2019. The session will be held on August 14 at 11:55 AM.
Dr. Jiangang (Jack) Zhao will discuss typical plasma applications that enable or improve process steps for wafer-level packaging (WLP) and present original data. As shown by the results, plasma treatment is the recommended process to improve interface adhesion and reduce the current leakage in WLP, as well as oxide removal from surfaces, avoiding micro-voids between the WLP layers.
“The first-hand data indicate that plasma can be used especially for improving platinum-copper (Pl-Cu) interface adhesion and eliminating possible micro-voids between the Cu seed layer and the electrically plated Cu layer during electroplating,” stated Dr. Zhao, applications director and chief scientist, Nordson MARCH. “The use of proper plasma recipes is very important for addressing the challenges of these WLP applications.”
A globally recognized expert in plasma technologies and author of numerous plasma studies, Dr. Zhao has worked for Nordson MARCH since 2001. He holds a doctorate in chemical engineering from the University of Missouri-Columbia and has worked in the plasma application field for 25 years and the IC packaging and coating industries for 20 years. Dr. Zhao is also an adjunct professor of Donghua University in China.
Other plasma treatments to be discussed in this paper include TSV cleaning, EMC removal from solder balls on wafer, and wafer-on-frame treatment. The presentation will be held during the ICEPT technical sessions in the Hong Kong Science Park, Shatin, Hong Kong, China.
