NY CREATES and TetraMem announced today that their partnership has led to the successful upscaling of TetraMem’s disruptive in-memory computing technologies from a 200mm wafer platform to the 300mm silicon platform, the foundation upon which next-gen AI computer chips are built. This positive collaboration has not only marked a turning point in TetraMem’s technology growth potential, but also underscores the transformative power of NY CREATES’ Albany NanoTech Complex, the most advanced non-profit 300mm R&D facility in the U.S.
Officials from the New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) and TetraMem, a world-leader in analog in-memory computing technology based in Fremont, California, strategically established this partnership to enable fabrication of TetraMem’s innovative technologies utilizing state-of-the-art semiconductor equipment at the Albany NanoTech Complex.
“We are thrilled to announce the tangible achievement resulting from our partnership with TetraMem, which showcases NY CREATES’ commitment to driving innovation and scalability within the semiconductor landscape,” said Dave Anderson, NY CREATES President. “This engagement speaks volumes about NY CREATES’ ability to assist high-tech organizations of all sizes in transitioning their technologies from lab to fab, which is also a critical goal of the U.S. CHIPS and Science Act as it aims to strengthen the broader semiconductor ecosystem through strategic investments.”
“TetraMem’s unique, brain-inspired, analog-RRAM-based in-memory computing technology changes the physics of how AI computations are performed. We required an innovative partner like NY CREATES to prove the scalability and manufacturability of our novel multilevel memristive devices to launch a new era in computing,” noted Dr. Glenn Ning Ge, TetraMem CEO and Co-founder. “Now the new memory is the computer. Together, we are delivering U.S. manufacturing of a disruptive technological advance that will help realize our GenAI future, and the billions of dollars that will add to the U.S. economy.”
The effort has been supported by the expertise of NY CREATES’ engineering staff and allows for the transfer of the processes used at the Albany NanoTech Complex to a foundry partner for mass manufacturing. Notably, this includes the successful adaptation of TetraMem’s technology to 300mm wafers. This represents a substantial leap from the previous 200mm format, with the same level of performance as published by TetraMem and partners in Nature, March 30, 2023. A smaller scale improves memory density, which enables higher yield and more cost-effective production.
Through the implementation of custom fabrication processes and the demonstration of a split-fab model, whereby companies can develop and test their computer chips before seamlessly mass producing them at a second, outside fab, this announcement successfully highlights how technology companies can navigate past scale-up challenges toward the ramp-up to full scale manufacturing.
“Our collaboration with TetraMem emphasizes the benefit of strategic partnerships in driving technological innovation for smaller businesses,” said Dr. Christopher Borst, Vice President of Technology and Infrastructure. “By combining TetraMem’s computing technology and using NY CREATES’ state-of-the-art tools and process development expertise at the Albany NanoTech Complex, we are proud to highlight this split-fab effort, which lays the foundation for future advancements utilizing our prototype-to-foundry enabling model.”
“With NY CREATES, TetraMem is positioned to deliver revolutionary efficiency and speed in AI computing for the next generation of edge devices. Our technology will unlock new capabilities for AI without telecommunications and data center dependencies for IoT, enterprises, and U.S. government customers,” said Gary Miner, TetraMem Executive Vice President.