Registration is open for the March 6-8 executive conference.
Nomination Period for Phil Kaufman Award and Hall of Fame Open Through June 30
The Phil Kaufman award recognizes individuals whose contributions made significant impacts to electronic system design (ESD) in technology innovation, business, industry direction, education or mentoring.
U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Scientists Shine New Light on the Future of Nanoelectronic Devices
Researchers develop novel method for studying brain-like circuitry in nanomaterials using Argonne’s Advanced Photon Source.
New Si2 Open Model Interface Provides Standard for Advanced SPICE Capabilities
The Silicon Integration Initiative Compact Model Coalition has released a new version of the Open Model Interface, an Si2 standard, C-language application programming interface that supports SPICE compact model extensions.
SEALSQ to Establish an OSAT Center in Saudi Arabia
SEALSQ Corp. today announced a significant initiative to establish an Open Semiconductors Assembly and Test (OSAT) Center in Saudi Arabia.
Greene Tweed Introduces Fusion F07 Performance-Enhanced FKM for Subfab Exhaust Lines
Greene Tweed, a global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Fusion F07, a performance-enhanced fluoroelastomer.
SEMI Publishes Priorities on European Economic Security Strategy
SEMI applauded the European Commission for inviting industry feedback as it formulates the European Economic Security Strategy to strengthen Europe’s economic security in the face of ongoing geopolitical tensions and strategic dependencies that characterize the European semiconductor industry.
Nanothin Printing of Electronics Hardware Could Slash Costs
Engineering researchers have developed a 2D printing process using liquid metals that they say could create new ways of creating more advanced and energy efficient computing hardware that is manufactured at the nanoscale.
CG Power and Industrial Solutions Limited, Renesas, and Stars Microelectronics, to Jointly Build OSAT Facility in India
The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.
