MAGAZINE
March
Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031
The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
OKI Circuit Technology has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
Intel’s Transition of OpenFL Primes Growth of Confidential AI
Today, Intel announced that the LF AI & Data Foundation Technical Advisory Council accepted Open Federated Learning (OpenFL) as an incubation project to further drive collaboration, standardization and interoperability.
Mythic Raises $13 Million to Bring Its Next-generation Analog Computing Solution to Market
Mythic, the pioneering AI processor company with breakthrough analog compute-in-memory technology, has raised $13 million in a new round of funding.
Global Semiconductor Sales Decrease 5.2% Month-to-Month in January
The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales totaled $41.3 billion during the month of January 2023.
RFMW Expands European Presence With Acquisition
RFMW, a specialized distributor of RF and microwave products, today announced the intention to acquire MRC Gigacomp (MRCG) and MRC Components (MRCC) in Germany.
Leading Edge AI Chipmaker Hailo Introduces Hailo-15
Hailo today announced its groundbreaking new Hailo-15 family of high-performance vision processors, designed for integration directly into intelligent cameras to deliver unprecedented video processing and analytics at the edge.
Boston Semi Equipment Receives Follow-On Order for Multiple High-Voltage Zeus Handlers
Boston Semi Equipment (BSE) today announced that it has received a follow-on order for multiple Zeus gravity handlers for high-voltage device testing.
Draper Opens New Office in Indiana
The office in WestGate@Crane Technology Park will support Microelectronics R&D, strategic programs for the Defense Department and the Naval Surface Warfare Center, Crane Division.
onsemi Commits to the Science Based Targets Initiative
onsemi today announced it has committed to the Science Based Target Initiative (SBTi).
Weebit Nano Partners with University of Florida’s Nino Research Group to Examine Effects of Radiation on Weebit ReRAM
Results of initial studies confirm Weebit ReRAM arrays are tolerant to high radiation levels.
Tokyo Electron Device Joins the Open Invention Network Community
Open Invention Network (OIN), the organization formed to safeguard open source and now the largest patent non-aggression community in history, announced today that Tokyo Electron Device, Ltd. (TED) has joined as a community member
Graphene Quantum Dots Show Promise as Novel Magnetic Field Sensors
Physicists found that speeding electrons trapped in circular loops in graphene quantum dots are highly sensitive to external magnetic fields.
Semiconductor Lithography Materials Trending Upwards
2023 economic slowdown to cause a short-term dip on photoresists & ancillaries.
Alphawave Semi Opens Ottawa Office
Located in the Kanata North technology park, the new office provides more than 20,000 square feet of working space with over 4,000 square feet of laboratory space for its controller, SerDes, and optical engineering teams.
NI Acquires SET GmbH to Accelerate Power Semiconductor and Aerospace/Defense Test System Development
NI today announced the acquisition of SET GmbH, long-standing experts in aerospace and defense test system development and recent innovators in power semiconductor reliability test.
Tata Consultancy Services and Renesas Partner to Open Innovation Center to Develop Next-Generation Semiconductor Solutions
Tata Consultancy Services and Renesas Electronics Corporation (Renesas), a supplier of advanced semiconductor solutions, announced the opening of a joint Innovation Center in Bengaluru and Hyderabad and to collaborate on radio frequency, digital and mixed-signal design and software development for innovative next generation semiconductor solutions catering to the needs of a wide range of industries.
SEMI North America Advisory Board Welcomes New Members From PEER Group, TEL US and TSMC
SEMI today announced the election of three new members to the SEMI North America Advisory Board (NAAB): Mike Kropp, President and CEO of PEER Group; Ben Rathsack, Vice President of Product and Technology Development at Tokyo Electron America, Inc. (TEL); and Peter Cleveland, Senior Vice President at Taiwan Semiconductor Manufacturing Company Limited (TSMC).
Chung-Ang University Researchers Fabricate Novel Flexible Supercapacitors on Paper
The researchers vertically integrate multiple gold electrodes within a single sheet of paper to create a super-dense energy storage device.
Omdia: 2022, A Record Year for Semiconductors That Feels Anything But
The semiconductor market reached an all-time high in 2022, with total revenue hitting $595.7B, just surpassing 2021’s record revenue of $592.8B.
JEDEC Creates New Automotive Steering Subcommittee
JEDEC Solid State Technology Association announces the formation of the JC-42.9 Automotive Steering Subcommittee responsible for investigating memory technologies and recommending solutions pertaining to automotive applications.
SRC Publishes Interim Microelectronics and Advanced Packaging Technologies Roadmap, Seeks Public Comments
Semiconductor Research Corporation (SRC), a world-renowned semiconductor research and workforce development consortium, released an interim report for the Microelectronic and Advanced Packaging Technologies (MAPT) Roadmap.
proteanTecs to Host Industry Experts for Panel Discussion on the Data Revolution of Semiconductor Production
The webinar features industry experts from Qualcomm, Microsoft Azure and Advantest and will be held on Tuesday, March 7 at 9 am PST/12 pm EST/6 pm CET.
Featured Video
At SEMICON West 2024, Advanced Energy further expanded on the theme of ‘Advancing the Angstrom Era’ by demonstrating its latest plasma power, high-voltage and critical temperature measurement and control technologies. Editor-in-Chief Pete Singer talked to Dhaval Dhayatkar, a Senior Director of Marketing of Plasma Power at Advanced Energy, about the company’s latest products, including new, modular platforms that meet demands for high power, high efficiency and power density AC-DC solutions across semiconductor processing and test equipment.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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