2025: A Paradigm Shift in Wire Interconnection

The drive towards high density (HD), ultra-high density (UHD) and alternative substrates, including glass, will be transformative for North American wire interconnection manufacturing in 2025.

2025: The Future of Flex Is Here

A rapidly accelerating trend is the proliferation of complex assembly directly onto flexible substrates.

2025: Power Efficiency and Computational Flexibility in AI/ML Processors

Compression, especially after quantization, can help reduce the bandwidth and large storage required by model weights, thereby reducing power consumption.

Micron Technology to Expand Manufacturing Facility in Manassas, Va.

Micron will invest up to $2.17 billion to expand its operation in the City of Manassas. The project will create 340 new jobs

Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

NexWafe Hits Key Milestones in Solar Efficiency and Scalability

NexWafe GmbH (NexWafe) today announced significant breakthroughs in its solar wafer manufacturing technology.

Micromax and Phison Partner to Launch MiPhi, Powering India’s Next-Generation of NAND Storage Technology

The joint venture will enable MiPhi to develop high-end and customized NAND storage products for enterprise, consumer, embedded, AI, and security applications for India and specific agreed-upon regions.

CreeLED Inc. Files Patent Infringement Lawsuit Against ADJ Products, LLC

Cree LED, a Penguin Solutions brand, today announced that it has filed a patent infringement lawsuit in the United States District Court for the Northern District of California against ADJ Products, LLC (ADJ).

SonicEdge Unveils World’s First MEMS Speaker-Microphone Solution for TWS Devices

SonicEdge LTD announced the launch of SonicTwin at CES 2025.