Intel Announces New Edge Platform for Scaling AI Applications

The edge-native software platform simplifies development, deployment and management of edge AI applications.

Enhancing Electrogenerated Chemiluminescence of an Iridium Complex

Researchers develop electrogenerated chemiluminescence cells that possess unprecedented levels of luminance and current efficiency.

Micron Commences Volume Production of Industry-Leading HBM3E Solution to Accelerate the Growth of AI

Micron Technology, Inc. today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution.

U.S. Department of Energy Announces $2.25 Million American-Made SiC Semiconductor Prize Competition

The U.S. Department of Energy’s (DOE) Office of Electricity (OE) today launched the American-Made Silicon Carbide (SiC) Semiconductor Packaging Prize.

Applied Materials Expands Patterning Solutions Portfolio for Angstrom Era Chipmaking

Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to address the patterning requirements of chips in the “angstrom era.”

Intel Foundry Expands Support for Ansys Multiphysics Signoff Solutions with Intel 18A Process Technology

Intel Foundry certified Ansys (NASDAQ: ANSS) multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 18A process technology with new RibbonFET transistor technology and backside power delivery.

TSMC’s Kumamoto Plant (JASM) Grand Opening on 24th February

TrendForce’s latest report reveals that in 2023, global foundry revenues hit US$117.47 billion, with TSMC capturing a dominant 60% share.

Mixed-Dimensional Transistors Enable High-Performance Multifunctional Electronic Devices

A research team led by materials scientists from City University of Hong Kong (CityUHK) recently discovered a new strategy for developing highly versatile electronics with outstanding performance, using transistors made of mixed-dimensional nanowires and nanoflakes.

Intrinsic ID Joins Intel Foundry Accelerator IP Alliance to Secure Leading-Edge Semiconductors

Intrinsic ID, the provider of Physical Unclonable Function (PUF) technology field-proven in more than 650 million devices across the globe, today announced that it is now a member of the Intel Foundry Accelerator IP Alliance program to ensure the availability of hardware-based root-of-trust (RoT) solutions for Intel Foundry customers.

Fujitsu Collaborates With QuTech

Fujitsu today announced a collaboration with QuTech for the development of the world’s first cryogenic electronic circuits for controlling diamond-based quantum bits.