Hyderabad based ASIP (Advanced System in Package Technologies) has announced the launch of its project with Korean company APACT Limited as a Joint Venture
Weebit Nano Demonstrates Performance of its ReRAM Under Extended Automotive Conditions
Weebit Nano Limited, a developer of advanced memory technologies for the global semiconductor industry, is demonstrating the high endurance and reliability of its Resistive Random-Access Memory (ReRAM) in extended automotive conditions, including high temperatures of 150 degrees Celsius and extended program cycles.
CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems
CEA-Leti has developed a keyword-spotting system that dramatically improves accuracy in always-on, voice-activated Edge-AI systems and that consumes less power in a far smaller silicon footprint than current technology.
Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
Synopsys, Inc. today announced its AI-driven digital and analog design flows are certified by Intel Foundry for the Intel 18A process.
Cadence and Intel Foundry Collaborate to Enable Heterogeneous Integration with EMIB Packaging Technology
Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures.
AI Chip Deals Remain Low; Chip Makers Take Over as Major Buyers, Reveals New Omdia Research
With demand for AI chips soaring, Omdia’s AI Processors Mergers & Acquisitions Tracker has revealed that AI chip deals remain low and that chip manufacturers are taking over as the major buyers.
Sony Semiconductor Israel Announces Commercial Availability of the Revolutionary ALT1350 LPWA Chipset
The new ALT1350, a game-changer for asset trackers and smart utility meters, boasts unmatched low power consumption and advanced location capabilities.
UC San Diego and CEA-Leti Report First IC for Piezoelectric Resonator DC-DC Conversion Achieving a 310% Loss Reduction
University of California San Diego and CEA-Leti scientists have developed a ground-breaking piezoelectric-based DC-DC converter that unifies all power switches onto a single chip to increase power density.
Samsung Electronics Collaborates with Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry’s Latest GAA Process Technology
Collaboration accelerates access to newest Arm CPU, enabling new class of SoCs with Generative AI capabilities.
Aerotech Invests in Korean Manufacturing Facility
Aerotech Inc., a global leader in precision motion control and automation, is expanding its partnership with Korean distributor ANI Motion Tech.
