TECHCET announced Mike (Michel) Walden as the new Senior Director of Market Research and Analytics for TECHCET.
Efabless Announces the Inaugural Chipalooza Analog and Mixed-Signal Design Challenge
Efabless Corporation, the creator platform for chips, is excited to announce the launch of the first Chipalooza Analog and Mixed-Signal Design Challenge, an innovative competition aimed at engineers and designers around the globe.
Researchers Invent New Way to Stretch Diamond for Better Quantum Bits
A future quantum network may become less of a stretch, thanks to researchers at the University of Chicago, Argonne National Laboratory and Cambridge University.
SIA Commends CHIPS Act Incentives for GlobalFoundries Projects
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and GlobalFoundries.
Cohu Announces Orders for New MEMS Microphone Tester
Cohu, Inc., a global supplier of equipment and services optimizing semiconductor manufacturing yield and productivity, today announced that a leading U.S. fabless semiconductor manufacturer has selected Sense+ system with µ-sense for testing their next generation high-fidelity microphones.
GlobalFoundries and Biden-Harris Administration Announce CHIPS and Science Act Funding for Essential Chip Manufacturing
$1.5 billion potential investment will support the expansion of GlobalFoundries New York facility, including construction of a new state-of-the art fab, and the modernization of its Vermont facility, adding secure capacity for essential chip manufacturing for automotive and other key markets.
IonQ Opens Doors to First Dedicated Quantum Computing Manufacturing Facility in the U.S.
Facility will manufacture quantum computers and plans to create thousands of new jobs and opportunities over the coming years.
HKUST Researchers Develop New Integration Technique for Efficient Coupling of III-V and Silicon
Researchers at the Hong Kong University of Science and Technology (HKUST) have developed a new integration technique for efficient integration of III-V compound semiconductor devices and silicon, paving the way for photonic integration at low cost, large volume, and high speed and throughput that could revolutionize data communications.
Semiconductor Revenue Forecast
After decline of -13%, TECHCET reports consecutive YoY double-digit growth.
Imec Launches the First Design Pathfinding Process Design Kit for N2 Node
The design pathfinding PDK lowers the threshold for academia and industry to access the most advanced semiconductor technologies
